Технічний опис B32563J3105M000 TDK ELECTRONICS
Description: CAP FILM 1UF 20% 2DIP, Packaging: Bulk, Tolerance: ±20%, Package / Case: 2-DIP, Mounting Type: Through Hole, Operating Temperature: -55°C ~ 125°C, Applications: General Purpose, Lead Spacing: 0.886" (22.50mm), Termination: PC Pins, Dielectric Material: Polyester, Polyethylene Terephthalate (PET), Metallized - Stacked, Capacitance: 1 µF.
Інші пропозиції B32563J3105M000
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| B32563J3105M000 | Виробник : EPCOS - TDK Electronics |
Description: CAP FILM 1UF 20% 2DIP Packaging: Bulk Tolerance: ±20% Package / Case: 2-DIP Mounting Type: Through Hole Operating Temperature: -55°C ~ 125°C Applications: General Purpose Lead Spacing: 0.886" (22.50mm) Termination: PC Pins Dielectric Material: Polyester, Polyethylene Terephthalate (PET), Metallized - Stacked Capacitance: 1 µF |
товару немає в наявності |
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B32563J3105M000 | Виробник : EPCOS / TDK | Film Capacitors FILM CAP MKT SILVER 1.0uF 20% 250Vdc LS 22.5mm |
товару немає в наявності |