B9B-ZR-SM4-TF(LF)(SN)

Виробник: JST / JAPAN SOLDERLESS TERMINALS
Description: JST / JAPAN SOLDERLESS TERMINALS - B9B-ZR-SM4-TF(LF)(SN) - Stiftleiste, Einführung oben, Wire-to-Board, 1.5 mm, 1 Reihe(n), 9 Kontakt(e), Oberflächenmontage
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Messing
isCanonical: Y
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 9Kontakt(e)
SVHC: No SVHC (25-Jun-2025)
Steckverbindersysteme: Wire-to-Board
Steckverbinder: PCB-Stiftleiste
Produktpalette: ZH
productTraceability: No
Kontaktanschluss: Oberflächenmontage
usEccn: EAR99
Anzahl der Reihen: 1Reihe(n)
Rastermaß: 1.5mm

Виробник: JST Sales America Inc.
Description: CONN HEADER SMD 9POS 1.5MM
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Detent Lock
Contact Type: Male Pin
Operating Temperature: -25°C ~ 85°C
Style: Board to Cable/Wire
Number of Rows: 1
Number of Positions: 9
Mounting Type: Surface Mount
Current Rating (Amps): 1A
Voltage Rating: 50V
Connector Type: Header
Features: Solder Retention
Packaging: Cut Tape (CT)
Insulation Material: Polyamide (PA6T), Nylon 6T, Glass Filled
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.197" (5.00mm)
Contact Shape: Circular
Part Status: Active
Contact Finish - Post: Tin
Contact Finish - Mating: Tin
Pitch - Mating: 0.059" (1.50mm)
Insulation Color: Natural
Contact Material: Brass
Material Flammability Rating: UL94 V-0