BGA0035 Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: BGA-196 TO PGA-196
Package Accepted: BGA
Proto Board Type: SMD to PGA
Board Thickness: 0.063" (1.60mm)
Pitch: 0.020" (0.50mm)
Number of Positions: 196
Material: FR4 Epoxy Glass
Size / Dimension: 2.300" L x 2.200" W (58.42mm x 55.88mm)
Packaging: Bulk
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Технічний опис BGA0035 Chip Quik Inc.
Description: BGA-196 TO PGA-196, Package Accepted: BGA, Proto Board Type: SMD to PGA, Board Thickness: 0.063" (1.60mm), Pitch: 0.020" (0.50mm), Number of Positions: 196, Material: FR4 Epoxy Glass, Size / Dimension: 2.300" L x 2.200" W (58.42mm x 55.88mm), Packaging: Bulk.



