Технічний опис BGS13SL9E6327XTSA1 Infineon Technologies
Description: IC RF SWITCH SP3T 3GHZ TSLP9-3, Packaging: Tape & Reel (TR), Package / Case: 9-XFLGA, Impedance: 50Ohm, Mounting Type: Surface Mount, Circuit: SP3T, RF Type: Bluetooth, WLAN, Operating Temperature: -30°C ~ 85°C, Voltage - Supply: 2.4V ~ 3.6V, Insertion Loss: 0.54dB, Frequency Range: 100MHz ~ 3GHz, Topology: Reflective, Test Frequency: 2.7GHz, Isolation: 22dB, Supplier Device Package: TSLP-9-3, Part Status: Obsolete.
Інші пропозиції BGS13SL9E6327XTSA1
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
 |
BGS13SL9E6327XTSA1 | Виробник : Infineon Technologies |
 RF Switch SP3T 100MHz to 3GHz 18dB 9-Pin TSLP T/R |
товар відсутній |
|
|
|
BGS13SL9E6327XTSA1 | Виробник : Infineon Technologies |
RF Switch SP3T 100MHz to 3GHz 18dB 9-Pin TSLP T/R |
товар відсутній |
|
 |
BGS13SL9E6327XTSA1 | Виробник : Infineon Technologies |
Description: IC RF SWITCH SP3T 3GHZ TSLP9-3 Packaging: Tape & Reel (TR) Package / Case: 9-XFLGA Impedance: 50Ohm Mounting Type: Surface Mount Circuit: SP3T RF Type: Bluetooth, WLAN Operating Temperature: -30°C ~ 85°C Voltage - Supply: 2.4V ~ 3.6V Insertion Loss: 0.54dB Frequency Range: 100MHz ~ 3GHz Topology: Reflective Test Frequency: 2.7GHz Isolation: 22dB Supplier Device Package: TSLP-9-3 Part Status: Obsolete |
товар відсутній |
|
|
|
BGS13SL9E6327XTSA1 | Виробник : Infineon Technologies |
Description: IC RF SWITCH SP3T 3GHZ TSLP9-3 Packaging: Cut Tape (CT) Package / Case: 9-XFLGA Impedance: 50Ohm Mounting Type: Surface Mount Circuit: SP3T RF Type: Bluetooth, WLAN Operating Temperature: -30°C ~ 85°C Voltage - Supply: 2.4V ~ 3.6V Insertion Loss: 0.54dB Frequency Range: 100MHz ~ 3GHz Topology: Reflective Test Frequency: 2.7GHz Isolation: 22dB Supplier Device Package: TSLP-9-3 Part Status: Obsolete |
товар відсутній |