BK13C06-50DS/2-0.35V(800) Hirose Electric Co Ltd
Виробник: Hirose Electric Co Ltd
Description: CONN RCPT 0.35MM SMD 50POS
Number of Rows: 2
Mated Stacking Heights: 0.6mm
Contact Finish Thickness: 1.97µin (0.050µm)
Height Above Board: 0.022" (0.57mm)
Pitch: 0.014" (0.35mm)
Number of Positions: 50
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Receptacle, Center Strip Contacts
Features: Solder Retention
Packaging: Cut Tape (CT)
| Кількість | Ціна |
|---|---|
| 4+ | 95.84 грн |
| 10+ | 74.81 грн |
| 25+ | 68.93 грн |
| 50+ | 60.84 грн |
| 100+ | 57.20 грн |
| 250+ | 52.73 грн |
| 500+ | 48.78 грн |
| 1000+ | 45.87 грн |
| 2500+ | 42.29 грн |
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Технічний опис BK13C06-50DS/2-0.35V(800) Hirose Electric Co Ltd
Description: CONN RCPT 0.35MM SMD 50POS, Number of Rows: 2, Mated Stacking Heights: 0.6mm, Contact Finish Thickness: 1.97µin (0.050µm), Height Above Board: 0.022" (0.57mm), Pitch: 0.014" (0.35mm), Number of Positions: 50, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Receptacle, Center Strip Contacts, Features: Solder Retention, Packaging: Tape & Reel (TR).
Інші пропозиції BK13C06-50DS/2-0.35V(800)
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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BK13C06-50DS/2-0.35V(800) | Виробник : Hirose Electric Co Ltd |
Description: CONN RCPT 0.35MM SMD 50POS Number of Rows: 2 Mated Stacking Heights: 0.6mm Contact Finish Thickness: 1.97µin (0.050µm) Height Above Board: 0.022" (0.57mm) Pitch: 0.014" (0.35mm) Number of Positions: 50 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Receptacle, Center Strip Contacts Features: Solder Retention Packaging: Tape & Reel (TR) |
товару немає в наявності |
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BK13C06-50DS/2-0.35V(800) | Виробник : Hirose Connector |
Board to Board & Mezzanine Connectors Low-Profile Hybrid FPC-to-Board Conn |
товару немає в наявності |