(SN).jpg "BM08B-ZESS-TBT(LF)(SN)")
BM08B-ZESS-TBT(LF)(SN) JST Sales America Inc.
Виробник: JST Sales America Inc.
Description: CONN HEADER SMD 8POS 1.5MM
Insulation Material: Polyamide (PA), Nylon
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.295" (7.50mm)
Contact Shape: Rectangular
Part Status: Active
Contact Finish - Post: Tin
Contact Finish - Mating: Tin
Pitch - Mating: 0.059" (1.50mm)
Insulation Color: Natural
Contact Material: Copper Alloy
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Locking Ramp
Contact Type: Outer Shroud Contact
Operating Temperature: -25°C ~ 85°C
Style: Board to Cable/Wire
Number of Rows: 1
Number of Positions: 8
Mounting Type: Surface Mount
Current Rating (Amps): 2A
Voltage Rating: 100V
Connector Type: Header
Features: Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
| Кількість | Ціна |
|---|---|
| 800+ | 52.00 грн |
| 1600+ | 42.92 грн |
| 2400+ | 41.49 грн |
| 5600+ | 37.59 грн |
| 8000+ | 35.71 грн |
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Технічний опис BM08B-ZESS-TBT(LF)(SN) JST Sales America Inc.
Description: CONN HEADER SMD 8POS 1.5MM, Insulation Material: Polyamide (PA), Nylon, Shrouding: Shrouded - 4 Wall, Insulation Height: 0.295" (7.50mm), Contact Shape: Rectangular, Part Status: Active, Contact Finish - Post: Tin, Contact Finish - Mating: Tin, Pitch - Mating: 0.059" (1.50mm), Insulation Color: Natural, Contact Material: Copper Alloy, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Locking Ramp, Contact Type: Outer Shroud Contact, Operating Temperature: -25°C ~ 85°C, Style: Board to Cable/Wire, Number of Rows: 1, Number of Positions: 8, Mounting Type: Surface Mount, Current Rating (Amps): 2A, Voltage Rating: 100V, Connector Type: Header, Features: Pick and Place, Solder Retention, Packaging: Tape & Reel (TR).
Інші пропозиції BM08B-ZESS-TBT(LF)(SN) за ціною від 28.14 грн до 92.87 грн
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
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BM08B-ZESS-TBT(LF)(SN) | JST Commercial |
Headers & Wire Housings CONNECTOR |
на замовлення 1672 шт: термін постачання 21-30 дні (днів) |
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BM08B-ZESS-TBT(LF)(SN) | JST Sales America Inc. |
Description: CONN HEADER SMD 8POS 1.5MM Insulation Material: Polyamide (PA), Nylon Shrouding: Shrouded - 4 Wall Insulation Height: 0.295" (7.50mm) Contact Shape: Rectangular Part Status: Active Contact Finish - Post: Tin Contact Finish - Mating: Tin Pitch - Mating: 0.059" (1.50mm) Insulation Color: Natural Contact Material: Copper Alloy Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Locking Ramp Contact Type: Outer Shroud Contact Operating Temperature: -25°C ~ 85°C Style: Board to Cable/Wire Number of Rows: 1 Number of Positions: 8 Mounting Type: Surface Mount Current Rating (Amps): 2A Voltage Rating: 100V Connector Type: Header Features: Pick and Place, Solder Retention Packaging: Cut Tape (CT) |
на замовлення 21657 шт: термін постачання 21-31 дні (днів) |
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BM08B-ZESS-TBT (LF)(SN) | JST / JAPAN SOLDERLESS TERMINALS |
Description: JST / JAPAN SOLDERLESS TERMINALS - BM08B-ZESS-TBT (LF)(SN) - Stiftleiste, Einführung oben, Wire-to-Board, 1.5 mm, 1 Reihe(n), 8 Kontakt(e), Oberflächenmontage tariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Verzinnte Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Kupfer isCanonical: Y Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 8Kontakt(e) SVHC: No SVHC (21-Jan-2025) Steckverbindersysteme: Wire-to-Board Steckverbinder: PCB-Stiftleiste Produktpalette: ZE productTraceability: No Kontaktanschluss: Oberflächenmontage usEccn: EAR99 Anzahl der Reihen: 1Reihe(n) Rastermaß: 1.5mm |
на замовлення 2543 шт: термін постачання 21-31 дні (днів) |
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| BM08B-ZESS-TBT(LF)(SN) |
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Виробник: JST Commercial
Headers & Wire Housings CONNECTOR
Headers & Wire Housings CONNECTOR
на замовлення 1672 шт:
термін постачання 21-30 дні (днів)
| Кількість | Ціна |
|---|---|
| 5+ | 70.79 грн |
| 10+ | 56.53 грн |
| 100+ | 40.08 грн |
| 500+ | 33.31 грн |
| 800+ | 30.24 грн |
| 2400+ | 28.91 грн |
| 5600+ | 28.14 грн |
| BM08B-ZESS-TBT(LF)(SN) |
|
Виробник: JST Sales America Inc.
Description: CONN HEADER SMD 8POS 1.5MM
Insulation Material: Polyamide (PA), Nylon
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.295" (7.50mm)
Contact Shape: Rectangular
Part Status: Active
Contact Finish - Post: Tin
Contact Finish - Mating: Tin
Pitch - Mating: 0.059" (1.50mm)
Insulation Color: Natural
Contact Material: Copper Alloy
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Locking Ramp
Contact Type: Outer Shroud Contact
Operating Temperature: -25°C ~ 85°C
Style: Board to Cable/Wire
Number of Rows: 1
Number of Positions: 8
Mounting Type: Surface Mount
Current Rating (Amps): 2A
Voltage Rating: 100V
Connector Type: Header
Features: Pick and Place, Solder Retention
Packaging: Cut Tape (CT)
Description: CONN HEADER SMD 8POS 1.5MM
Insulation Material: Polyamide (PA), Nylon
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.295" (7.50mm)
Contact Shape: Rectangular
Part Status: Active
Contact Finish - Post: Tin
Contact Finish - Mating: Tin
Pitch - Mating: 0.059" (1.50mm)
Insulation Color: Natural
Contact Material: Copper Alloy
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Locking Ramp
Contact Type: Outer Shroud Contact
Operating Temperature: -25°C ~ 85°C
Style: Board to Cable/Wire
Number of Rows: 1
Number of Positions: 8
Mounting Type: Surface Mount
Current Rating (Amps): 2A
Voltage Rating: 100V
Connector Type: Header
Features: Pick and Place, Solder Retention
Packaging: Cut Tape (CT)
на замовлення 21657 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 4+ | 86.41 грн |
| 10+ | 70.12 грн |
| 100+ | 62.95 грн |
| BM08B-ZESS-TBT (LF)(SN) |
Виробник: JST / JAPAN SOLDERLESS TERMINALS
Description: JST / JAPAN SOLDERLESS TERMINALS - BM08B-ZESS-TBT (LF)(SN) - Stiftleiste, Einführung oben, Wire-to-Board, 1.5 mm, 1 Reihe(n), 8 Kontakt(e), Oberflächenmontage
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Kupfer
isCanonical: Y
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 8Kontakt(e)
SVHC: No SVHC (21-Jan-2025)
Steckverbindersysteme: Wire-to-Board
Steckverbinder: PCB-Stiftleiste
Produktpalette: ZE
productTraceability: No
Kontaktanschluss: Oberflächenmontage
usEccn: EAR99
Anzahl der Reihen: 1Reihe(n)
Rastermaß: 1.5mm
Description: JST / JAPAN SOLDERLESS TERMINALS - BM08B-ZESS-TBT (LF)(SN) - Stiftleiste, Einführung oben, Wire-to-Board, 1.5 mm, 1 Reihe(n), 8 Kontakt(e), Oberflächenmontage
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Kupfer
isCanonical: Y
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 8Kontakt(e)
SVHC: No SVHC (21-Jan-2025)
Steckverbindersysteme: Wire-to-Board
Steckverbinder: PCB-Stiftleiste
Produktpalette: ZE
productTraceability: No
Kontaktanschluss: Oberflächenmontage
usEccn: EAR99
Anzahl der Reihen: 1Reihe(n)
Rastermaß: 1.5mm
на замовлення 2543 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 9+ | 92.87 грн |
| 11+ | 74.87 грн |
| 100+ | 58.33 грн |
| 500+ | 53.10 грн |