-50DP-0.4V(51).jpg "BM10B(0.8)-50DP-0.4V(51)")
BM10B(0.8)-50DP-0.4V(51) Hirose Electric Co Ltd
Виробник: Hirose Electric Co LtdDescription: CONN HDR 50POS SMD GOLD
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 50
Pitch: 0.016" (0.40mm)
Height Above Board: 0.025" (0.63mm)
Contact Finish Thickness: 2.00µin (0.051µm)
Mated Stacking Heights: 0.8mm
Number of Rows: 2
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Технічний опис BM10B(0.8)-50DP-0.4V(51) Hirose Electric Co Ltd
Description: CONN HDR 50POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 50, Pitch: 0.016" (0.40mm), Height Above Board: 0.025" (0.63mm), Contact Finish Thickness: 2.00µin (0.051µm), Mated Stacking Heights: 0.8mm, Number of Rows: 2.
Інші пропозиції BM10B(0.8)-50DP-0.4V(51)
| Фото | Назва | Виробник | Інформація |
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BM10B(0.8)-50DP-0.4V(51) | Виробник : Hirose Electric Co Ltd |
Description: CONN HDR 50POS SMD GOLD Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 50 Pitch: 0.016" (0.40mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 |
товар відсутній |
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BM10B(0.8)-50DP-0.4V(51) | Виробник : Hirose Connector |
Board to Board & Mezzanine Connectors 0.4MM FPC TO BOARD 50P HDR 0.8 HGHT |
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