BM10B-ZESS-TBT(LF)(SN) JST Sales America Inc.
Виробник: JST Sales America Inc.
Description: CONN HEADER SMD 10POS 1.5MM
Insulation Material: Polyamide (PA), Nylon
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Locking Ramp
Contact Type: Outer Shroud Contact
Operating Temperature: -25°C ~ 85°C
Style: Board to Cable/Wire
Number of Rows: 1
Number of Positions: 10
Mounting Type: Surface Mount
Current Rating (Amps): 2A
Voltage Rating: 100V
Connector Type: Header
Features: Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.295" (7.50mm)
Contact Shape: Rectangular
Part Status: Active
Contact Finish - Post: Tin
Contact Finish - Mating: Tin
Pitch - Mating: 0.059" (1.50mm)
Insulation Color: Natural
Contact Material: Copper Alloy
Material Flammability Rating: UL94 V-0
| Кількість | Ціна |
|---|---|
| 800+ | 58.90 грн |
| 1600+ | 48.62 грн |
| 2400+ | 47.00 грн |
| 5600+ | 42.58 грн |
| 8000+ | 40.46 грн |
Відгуки про товар
Написати відгук
Технічний опис BM10B-ZESS-TBT(LF)(SN) JST Sales America Inc.
Description: CONN HEADER SMD 10POS 1.5MM, Insulation Material: Polyamide (PA), Nylon, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Locking Ramp, Contact Type: Outer Shroud Contact, Operating Temperature: -25°C ~ 85°C, Style: Board to Cable/Wire, Number of Rows: 1, Number of Positions: 10, Mounting Type: Surface Mount, Current Rating (Amps): 2A, Voltage Rating: 100V, Connector Type: Header, Features: Pick and Place, Solder Retention, Packaging: Tape & Reel (TR), Shrouding: Shrouded - 4 Wall, Insulation Height: 0.295" (7.50mm), Contact Shape: Rectangular, Part Status: Active, Contact Finish - Post: Tin, Contact Finish - Mating: Tin, Pitch - Mating: 0.059" (1.50mm), Insulation Color: Natural, Contact Material: Copper Alloy, Material Flammability Rating: UL94 V-0.
Інші пропозиції BM10B-ZESS-TBT(LF)(SN) за ціною від 31.85 грн до 97.79 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
BM10B-ZESS-TBT (LF)(SN) | Виробник : JST / JAPAN SOLDERLESS TERMINALS |
Description: JST / JAPAN SOLDERLESS TERMINALS - BM10B-ZESS-TBT (LF)(SN) - Stiftleiste, Einführung oben, Wire-to-Board, 1.5 mm, 1 Reihe(n), 10 Kontakt(e), OberflächenmontagetariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Verzinnte Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Kupfer isCanonical: Y usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 10Kontakt(e) euEccn: NLR Steckverbindersysteme: Wire-to-Board Steckverbinder: PCB-Stiftleiste Produktpalette: ZE productTraceability: No Kontaktanschluss: Oberflächenmontage Anzahl der Reihen: 1Reihe(n) Rastermaß: 1.5mm SVHC: No SVHC (21-Jan-2025) |
на замовлення 761 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
|
BM10B-ZESS-TBT(LF)(SN) | Виробник : JST Sales America Inc. |
Description: CONN HEADER SMD 10POS 1.5MMContact Finish - Post: Tin Contact Finish - Mating: Tin Pitch - Mating: 0.059" (1.50mm) Insulation Color: Natural Contact Material: Copper Alloy Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Locking Ramp Contact Type: Outer Shroud Contact Operating Temperature: -25°C ~ 85°C Style: Board to Cable/Wire Number of Rows: 1 Number of Positions: 10 Mounting Type: Surface Mount Current Rating (Amps): 2A Voltage Rating: 100V Connector Type: Header Features: Pick and Place, Solder Retention Packaging: Cut Tape (CT) Insulation Material: Polyamide (PA), Nylon Shrouding: Shrouded - 4 Wall Insulation Height: 0.295" (7.50mm) Contact Shape: Rectangular Part Status: Active |
на замовлення 10935 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
| BM10B-ZESS-TBT(LF)(SN) | Виробник : JST Commercial |
Headers & Wire Housings ZE HEADER (SMT TOP) |
на замовлення 734 шт: термін постачання 21-30 дні (днів) |
|
|||||||||||||
| BM10B-ZESS-TBT-LFSN | Виробник : JST |
Automotive Connectors Not Available at Mouser |
товару немає в наявності |
