BM10NB(0.6)-10DS-0.4V(51) Hirose Connector
Виробник: Hirose Connector
Board to Board & Mezzanine Connectors 0.4MM FPC TO BOARD 10P RECP 0.6 HGHT
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Технічний опис BM10NB(0.6)-10DS-0.4V(51) Hirose Connector
Description: CONN RCPT 10POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 10, Pitch: 0.016" (0.40mm), Height Above Board: 0.024" (0.61mm), Contact Finish Thickness: 2.00µin (0.051µm), Mated Stacking Heights: 0.6mm, Part Status: Obsolete, Number of Rows: 2.
Інші пропозиції BM10NB(0.6)-10DS-0.4V(51)
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
|---|---|---|---|---|---|
|
BM10NB(0.6)-10DS-0.4V(51) | Hirose Electric Co Ltd |
Description: CONN RCPT 10POS SMD GOLDFeatures: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 10 Pitch: 0.016" (0.40mm) Height Above Board: 0.024" (0.61mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.6mm Part Status: Obsolete Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. |
|
BM10NB(0.6)-10DS-0.4V(51) | Hirose Electric Co Ltd |
Description: CONN RCPT 10POS SMD GOLDNumber of Rows: 2 Part Status: Obsolete Mated Stacking Heights: 0.6mm Contact Finish Thickness: 2.00µin (0.051µm) Height Above Board: 0.024" (0.61mm) Pitch: 0.016" (0.40mm) Number of Positions: 10 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Receptacle, Center Strip Contacts Features: Solder Retention Packaging: Cut Tape (CT) |
товару немає в наявності |
В кошику од. на суму грн. |
| BM10NB(0.6)-10DS-0.4V(51) |
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Виробник: Hirose Electric Co Ltd
Description: CONN RCPT 10POS SMD GOLD
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Height Above Board: 0.024" (0.61mm)
Contact Finish Thickness: 2.00µin (0.051µm)
Mated Stacking Heights: 0.6mm
Part Status: Obsolete
Number of Rows: 2
Description: CONN RCPT 10POS SMD GOLD
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Height Above Board: 0.024" (0.61mm)
Contact Finish Thickness: 2.00µin (0.051µm)
Mated Stacking Heights: 0.6mm
Part Status: Obsolete
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| BM10NB(0.6)-10DS-0.4V(51) |
![]() |
Виробник: Hirose Electric Co Ltd
Description: CONN RCPT 10POS SMD GOLD
Number of Rows: 2
Part Status: Obsolete
Mated Stacking Heights: 0.6mm
Contact Finish Thickness: 2.00µin (0.051µm)
Height Above Board: 0.024" (0.61mm)
Pitch: 0.016" (0.40mm)
Number of Positions: 10
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Receptacle, Center Strip Contacts
Features: Solder Retention
Packaging: Cut Tape (CT)
Description: CONN RCPT 10POS SMD GOLD
Number of Rows: 2
Part Status: Obsolete
Mated Stacking Heights: 0.6mm
Contact Finish Thickness: 2.00µin (0.051µm)
Height Above Board: 0.024" (0.61mm)
Pitch: 0.016" (0.40mm)
Number of Positions: 10
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Receptacle, Center Strip Contacts
Features: Solder Retention
Packaging: Cut Tape (CT)
товару немає в наявності
В кошику
од. на суму грн.



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