BM14B(0.8)-60DS-0.4V(53) Hirose Electric Co Ltd
Виробник: Hirose Electric Co Ltd
Description: CONN RCPT 60POS SMD GOLD
Number of Rows: 2
Part Status: Active
Mated Stacking Heights: 0.8mm
Contact Finish Thickness: 2.00µin (0.051µm)
Height Above Board: 0.031" (0.80mm)
Pitch: 0.016" (0.40mm)
Number of Positions: 60
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Receptacle, Center Strip Contacts
Features: Solder Retention
Packaging: Cut Tape (CT)
| Кількість | Ціна |
|---|---|
| 3+ | 142.19 грн |
| 10+ | 116.50 грн |
| 25+ | 109.17 грн |
| 50+ | 97.56 грн |
| 100+ | 92.89 грн |
| 250+ | 87.07 грн |
| 500+ | 81.55 грн |
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Технічний опис BM14B(0.8)-60DS-0.4V(53) Hirose Electric Co Ltd
Description: CONN RCPT 60POS SMD GOLD, Number of Rows: 2, Part Status: Active, Mated Stacking Heights: 0.8mm, Contact Finish Thickness: 2.00µin (0.051µm), Height Above Board: 0.031" (0.80mm), Pitch: 0.016" (0.40mm), Number of Positions: 60, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Receptacle, Center Strip Contacts, Features: Solder Retention, Packaging: Tape & Reel (TR).
Інші пропозиції BM14B(0.8)-60DS-0.4V(53)
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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BM14B(0.8)-60DS-0.4V(53) | Виробник : Hirose Electric Co Ltd |
Description: CONN RCPT 60POS SMD GOLD Number of Rows: 2 Part Status: Active Mated Stacking Heights: 0.8mm Contact Finish Thickness: 2.00µin (0.051µm) Height Above Board: 0.031" (0.80mm) Pitch: 0.016" (0.40mm) Number of Positions: 60 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Receptacle, Center Strip Contacts Features: Solder Retention Packaging: Tape & Reel (TR) |
товару немає в наявності |
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BM14B(0.8)-60DS-0.4V(53) | Виробник : Hirose Connector |
Board to Board & Mezzanine Connectors 60P DR RCP B2B/B2FPC 0.8mm H 0.4mm P VSM |
товару немає в наявності |