Технічний опис BM15FR0.8-24DS-0.35V(53) HIROSE
Description: CONN RCPT 24POS SMD GOLD, Packaging: Tape & Reel (TR), Features: Solder Retention, Connector Type: Receptacle, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 24, Pitch: 0.014" (0.35mm), Height Above Board: 0.031" (0.80mm), Contact Finish Thickness: 2.00µin (0.051µm), Mated Stacking Heights: 0.8mm, Number of Rows: 2.
Інші пропозиції BM15FR0.8-24DS-0.35V(53)
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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BM15FR0.8-24DS-0.35V(53) | Виробник : Hirose Electric Co Ltd |
![]() Packaging: Tape & Reel (TR) Features: Solder Retention Connector Type: Receptacle, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 24 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 |
товару немає в наявності |
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BM15FR0.8-24DS-0.35V(53) | Виробник : Hirose Electric Co Ltd |
![]() Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Receptacle, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 24 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 |
товару немає в наявності |
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BM15FR0.8-24DS-0.35V(53) | Виробник : Hirose Connector |
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товару немає в наявності |