BM15FR0.8-30DS-0.35V(53) Hirose Electric Co Ltd
Виробник: Hirose Electric Co LtdDescription: CONN RCPT 30POS SMD GOLD
Packaging: Cut Tape (CT)
Features: Solder Retention
Connector Type: Receptacle, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.014" (0.35mm)
Height Above Board: 0.031" (0.80mm)
Contact Finish Thickness: 2.00µin (0.051µm)
Mated Stacking Heights: 0.8mm
Part Status: Active
Number of Rows: 2
на замовлення 906 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 3+ | 132.32 грн |
| 10+ | 116.07 грн |
| 25+ | 108.94 грн |
| 50+ | 97.79 грн |
| 100+ | 93.35 грн |
| 250+ | 84.46 грн |
| 500+ | 76.52 грн |
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Технічний опис BM15FR0.8-30DS-0.35V(53) Hirose Electric Co Ltd
Description: CONN RCPT 30POS SMD GOLD, Packaging: Tape & Reel (TR), Features: Solder Retention, Connector Type: Receptacle, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 30, Pitch: 0.014" (0.35mm), Height Above Board: 0.031" (0.80mm), Contact Finish Thickness: 2.00µin (0.051µm), Mated Stacking Heights: 0.8mm, Part Status: Active, Number of Rows: 2.
Інші пропозиції BM15FR0.8-30DS-0.35V(53)
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| BM15FR0.8-30DS-0.35V(53) | Виробник : Hirose Electric Co Ltd |
Description: CONN RCPT 30POS SMD GOLDPackaging: Tape & Reel (TR) Features: Solder Retention Connector Type: Receptacle, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.8mm Part Status: Active Number of Rows: 2 |
товару немає в наявності |
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BM15FR0.8-30DS-0.35V(53) | Виробник : Hirose Connector |
Board to Board & Mezzanine Connectors 0.35MM DR REC 30P SMT VRT MNT |
товару немає в наявності |