Технічний опис BM23FR0.6-30DP-0.35V(51) HIROSE
Description: CONN HDR 30POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 30, Pitch: 0.014" (0.35mm), Height Above Board: 0.020" (0.50mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.6mm, Number of Rows: 2.
Інші пропозиції BM23FR0.6-30DP-0.35V(51)
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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BM23FR0.6-30DP-0.35V(51) | Виробник : Hirose Electric Co Ltd |
 Description: CONN HDR 30POS SMD GOLDFeatures: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.014" (0.35mm) Height Above Board: 0.020" (0.50mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.6mm Number of Rows: 2 |
товару немає в наявності |
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BM23FR0.6-30DP-0.35V(51) | Виробник : Hirose Connector |
Board to Board & Mezzanine Connectors 30P HDR STRGHT SMT SIGNAL ONLY |
товару немає в наявності |