BM23FR0.8-18DP-0.35V(895) Hirose Electric Co Ltd
Виробник: Hirose Electric Co Ltd
Description: CONN HDR 18POS SMD GOLD
Number of Rows: 2
Mated Stacking Heights: 0.8mm
Contact Finish Thickness: 1.97µin (0.050µm)
Height Above Board: 0.025" (0.63mm)
Pitch: 0.014" (0.35mm)
Number of Positions: 18
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Header, Outer Shroud Contacts
Features: Solder Retention
Packaging: Cut Tape (CT)
| Кількість | Ціна |
|---|---|
| 5+ | 73.58 грн |
| 10+ | 59.81 грн |
| 25+ | 56.07 грн |
| 50+ | 50.11 грн |
| 100+ | 47.71 грн |
| 250+ | 44.72 грн |
| 500+ | 41.88 грн |
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Технічний опис BM23FR0.8-18DP-0.35V(895) Hirose Electric Co Ltd
Description: CONN HDR 18POS SMD GOLD, Number of Rows: 2, Mated Stacking Heights: 0.8mm, Contact Finish Thickness: 1.97µin (0.050µm), Height Above Board: 0.025" (0.63mm), Pitch: 0.014" (0.35mm), Number of Positions: 18, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Header, Outer Shroud Contacts, Features: Solder Retention, Packaging: Tape & Reel (TR).
Інші пропозиції BM23FR0.8-18DP-0.35V(895)
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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BM23FR0.8-18DP-0.35V(895) | Виробник : Hirose Electric Co Ltd |
Description: CONN HDR 18POS SMD GOLD Number of Rows: 2 Mated Stacking Heights: 0.8mm Contact Finish Thickness: 1.97µin (0.050µm) Height Above Board: 0.025" (0.63mm) Pitch: 0.014" (0.35mm) Number of Positions: 18 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Header, Outer Shroud Contacts Features: Solder Retention Packaging: Tape & Reel (TR) |
товару немає в наявності |
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BM23FR0.8-18DP-0.35V(895) | Виробник : Hirose Connector |
Board to Board & Mezzanine Connectors 18P HDR STRGHT SMT SIGNAL ONLY |
товару немає в наявності |