BM23FR0.8-60DP-0.35V(895) Hirose Electric Co Ltd
Виробник: Hirose Electric Co Ltd
Description: CONN HDR 60POS SMD GOLD
Packaging: Cut Tape (CT)
Number of Rows: 2
Part Status: Active
Mated Stacking Heights: 0.8mm
Contact Finish Thickness: 1.97µin (0.050µm)
Height Above Board: 0.025" (0.63mm)
Pitch: 0.014" (0.35mm)
Number of Positions: 60
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Header, Outer Shroud Contacts
Features: Solder Retention
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 113.91 грн |
| 10+ | 89.25 грн |
| 25+ | 82.26 грн |
| 50+ | 72.59 грн |
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Технічний опис BM23FR0.8-60DP-0.35V(895) Hirose Electric Co Ltd
Description: CONN HDR 60POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 60, Pitch: 0.014" (0.35mm), Height Above Board: 0.025" (0.63mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.8mm, Part Status: Active, Number of Rows: 2.
Інші пропозиції BM23FR0.8-60DP-0.35V(895)
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
|
|
BM23FR0.8-60DP-0.35V(895) | Hirose Electric Co Ltd |
Description: CONN HDR 60POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 60 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Part Status: Active Number of Rows: 2 |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. |
 |
BM23FR0.8-60DP-0.35V(895) | Hirose Connector |
Board to Board & Mezzanine Connectors 60P HDR STRGHT SMT SIGNAL ONLY |
товару немає в наявності |
В кошику од. на суму грн. |
| BM23FR0.8-60DP-0.35V(895) |
|
Виробник: Hirose Electric Co Ltd
Description: CONN HDR 60POS SMD GOLD
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.014" (0.35mm)
Height Above Board: 0.025" (0.63mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.8mm
Part Status: Active
Number of Rows: 2
Description: CONN HDR 60POS SMD GOLD
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.014" (0.35mm)
Height Above Board: 0.025" (0.63mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.8mm
Part Status: Active
Number of Rows: 2
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику
од. на суму грн.
| BM23FR0.8-60DP-0.35V(895) |
|
Виробник: Hirose Connector
Board to Board & Mezzanine Connectors 60P HDR STRGHT SMT SIGNAL ONLY
Board to Board & Mezzanine Connectors 60P HDR STRGHT SMT SIGNAL ONLY
товару немає в наявності
В кошику
од. на суму грн.