BM23FR0.8-60DP-0.35V(895) Hirose Electric Co Ltd
Виробник: Hirose Electric Co LtdDescription: CONN HDR 60POS SMD GOLD
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.014" (0.35mm)
Height Above Board: 0.025" (0.63mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.8mm
Part Status: Active
Number of Rows: 2
на замовлення 54 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 3+ | 120.04 грн |
| 10+ | 94.05 грн |
| 25+ | 86.69 грн |
| 50+ | 76.50 грн |
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Технічний опис BM23FR0.8-60DP-0.35V(895) Hirose Electric Co Ltd
Description: CONN HDR 60POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 60, Pitch: 0.014" (0.35mm), Height Above Board: 0.025" (0.63mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.8mm, Part Status: Active, Number of Rows: 2.
Інші пропозиції BM23FR0.8-60DP-0.35V(895)
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
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BM23FR0.8-60DP-0.35V(895) | Виробник : Hirose Electric Co Ltd |
Description: CONN HDR 60POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 60 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Part Status: Active Number of Rows: 2 |
товару немає в наявності |
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BM23FR0.8-60DP-0.35V(895) | Виробник : Hirose Connector |
Board to Board & Mezzanine Connectors 60P HDR STRGHT SMT SIGNAL ONLY |
товару немає в наявності |