BM23PF0.8-10DP-0.35V(51) Hirose Electric Co Ltd
Виробник: Hirose Electric Co Ltd
Description: CONN HDR 10POS SMD GOLD
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 10
Pitch: 0.014" (0.35mm)
Height Above Board: 0.025" (0.63mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.8mm
Number of Rows: 2
Відгуки про товар
Написати відгук
Технічний опис BM23PF0.8-10DP-0.35V(51) Hirose Electric Co Ltd
Description: CONN HDR 10POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 10, Pitch: 0.014" (0.35mm), Height Above Board: 0.025" (0.63mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.8mm, Number of Rows: 2.
Інші пропозиції BM23PF0.8-10DP-0.35V(51) за ціною від 31.65 грн до 61.99 грн
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
BM23PF0.8-10DP-0.35V(51) | Hirose Electric Co Ltd |
Description: CONN HDR 10POS SMD GOLDFeatures: Solder Retention Packaging: Cut Tape (CT) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 10 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 |
на замовлення 19551 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||||
|
BM23PF0.8-10DP-0.35V(51) | Hirose Connector |
Board to Board & Mezzanine Connectors 10P HDR STRGHT SMT HYBRID W/POWER |
на замовлення 111 шт: термін постачання 21-30 дні (днів) |
В кошику од. на суму грн. |
| BM23PF0.8-10DP-0.35V(51) |
![]() |
Виробник: Hirose Electric Co Ltd
Description: CONN HDR 10POS SMD GOLD
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 10
Pitch: 0.014" (0.35mm)
Height Above Board: 0.025" (0.63mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.8mm
Number of Rows: 2
Description: CONN HDR 10POS SMD GOLD
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 10
Pitch: 0.014" (0.35mm)
Height Above Board: 0.025" (0.63mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.8mm
Number of Rows: 2
на замовлення 19551 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 61.99 грн |
| 10+ | 50.67 грн |
| 25+ | 47.46 грн |
| 50+ | 42.41 грн |
| 100+ | 40.38 грн |
| 250+ | 37.85 грн |
| 500+ | 35.45 грн |
| 1000+ | 33.76 грн |
| 2500+ | 31.65 грн |
| BM23PF0.8-10DP-0.35V(51) |
![]() |
Виробник: Hirose Connector
Board to Board & Mezzanine Connectors 10P HDR STRGHT SMT HYBRID W/POWER
Board to Board & Mezzanine Connectors 10P HDR STRGHT SMT HYBRID W/POWER
на замовлення 111 шт:
термін постачання 21-30 дні (днів)


