BM28B0.6-50DP/2-0.35V(51) Hirose Electric Co Ltd
Виробник: Hirose Electric Co Ltd
Description: CONN HDR 50POS SMD GOLD
Height Above Board: 0.018" (0.46mm)
Pitch: 0.014" (0.35mm)
Number of Positions: 50
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Header, Outer Shroud Contacts
Features: Solder Retention
Packaging: Cut Tape (CT)
Number of Rows: 2
Mated Stacking Heights: 0.6mm
Contact Finish Thickness: 1.97µin (0.050µm)
| Кількість | Ціна |
|---|---|
| 4+ | 87.03 грн |
| 10+ | 67.96 грн |
| 25+ | 62.66 грн |
| 50+ | 55.31 грн |
| 100+ | 52.00 грн |
| 250+ | 47.94 грн |
| 500+ | 44.35 грн |
| 1000+ | 41.70 грн |
| 2500+ | 38.45 грн |
Відгуки про товар
Написати відгук
Технічний опис BM28B0.6-50DP/2-0.35V(51) Hirose Electric Co Ltd
Description: CONN HDR 50POS SMD GOLD, Number of Rows: 2, Mated Stacking Heights: 0.6mm, Contact Finish Thickness: 1.97µin (0.050µm), Height Above Board: 0.018" (0.46mm), Pitch: 0.014" (0.35mm), Number of Positions: 50, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Header, Outer Shroud Contacts, Features: Solder Retention, Packaging: Tape & Reel (TR).
Інші пропозиції BM28B0.6-50DP/2-0.35V(51)
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
|
|
BM28B0.6-50DP/2-0.35V(51) | Виробник : Hirose Electric Co Ltd |
Description: CONN HDR 50POS SMD GOLD Number of Rows: 2 Mated Stacking Heights: 0.6mm Contact Finish Thickness: 1.97µin (0.050µm) Height Above Board: 0.018" (0.46mm) Pitch: 0.014" (0.35mm) Number of Positions: 50 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Header, Outer Shroud Contacts Features: Solder Retention Packaging: Tape & Reel (TR) |
товару немає в наявності |
|
 |
BM28B0.6-50DP/2-0.35V(51) | Виробник : Hirose Connector |
Board to Board & Mezzanine Connectors 50P Header Straight SMT |
товару немає в наявності |