BM28B0.6-60DP/2-0.35V(51) Hirose Electric Co Ltd
Виробник: Hirose Electric Co Ltd
Description: CONN HDR SMD GOLD
Number of Rows: 2
Mated Stacking Heights: 0.6mm
Contact Finish Thickness: 1.97µin (0.050µm)
Height Above Board: 0.018" (0.46mm)
Pitch: 0.014" (0.35mm)
Number of Positions: 62 (60 + 2 Power)
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Header, Outer Shroud Contacts
Features: Solder Retention
Packaging: Cut Tape (CT)
| Кількість | Ціна |
|---|---|
| 4+ | 84.65 грн |
| 10+ | 69.56 грн |
| 25+ | 65.22 грн |
| 50+ | 58.27 грн |
| 100+ | 55.48 грн |
| 250+ | 52.00 грн |
| 500+ | 48.71 грн |
| 1000+ | 46.38 грн |
| 2500+ | 44.61 грн |
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Технічний опис BM28B0.6-60DP/2-0.35V(51) Hirose Electric Co Ltd
Description: CONN HDR SMD GOLD, Number of Rows: 2, Mated Stacking Heights: 0.6mm, Contact Finish Thickness: 1.97µin (0.050µm), Height Above Board: 0.018" (0.46mm), Pitch: 0.014" (0.35mm), Number of Positions: 62 (60 + 2 Power), Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Header, Outer Shroud Contacts, Features: Solder Retention, Packaging: Tape & Reel (TR).
Інші пропозиції BM28B0.6-60DP/2-0.35V(51)
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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BM28B0.6-60DP/2-0.35V(51) | Виробник : Hirose Electric Co Ltd |
Description: CONN HDR SMD GOLD Number of Rows: 2 Mated Stacking Heights: 0.6mm Contact Finish Thickness: 1.97µin (0.050µm) Height Above Board: 0.018" (0.46mm) Pitch: 0.014" (0.35mm) Number of Positions: 62 (60 + 2 Power) Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Header, Outer Shroud Contacts Features: Solder Retention Packaging: Tape & Reel (TR) |
товару немає в наявності |
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BM28B0.6-60DP/2-0.35V(51) | Виробник : Hirose Connector |
Board to Board & Mezzanine Connectors |
товару немає в наявності |