BM46B-12DS-0.35V(51) Hirose Electric Co Ltd
Виробник: Hirose Electric Co Ltd
Description: CONN RCPT 0.35MM SMD GOLD 12POS
Number of Rows: 2
Mated Stacking Heights: 0.6mm
Contact Finish Thickness: 1.18µin (0.030µm)
Height Above Board: 0.024" (0.61mm)
Pitch: 0.014" (0.35mm)
Number of Positions: 12
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Receptacle, Center Strip Contacts
Features: Solder Retention
Packaging: Cut Tape (CT)
| Кількість | Ціна |
|---|---|
| 4+ | 94.27 грн |
| 10+ | 76.86 грн |
| 25+ | 73.65 грн |
| 50+ | 67.65 грн |
| 100+ | 64.72 грн |
| 250+ | 58.83 грн |
| 500+ | 52.08 грн |
| 1000+ | 46.29 грн |
| 2500+ | 41.95 грн |
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Технічний опис BM46B-12DS-0.35V(51) Hirose Electric Co Ltd
Description: CONN RCPT 0.35MM SMD GOLD 12POS, Number of Rows: 2, Mated Stacking Heights: 0.6mm, Contact Finish Thickness: 1.18µin (0.030µm), Height Above Board: 0.024" (0.61mm), Pitch: 0.014" (0.35mm), Number of Positions: 12, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Receptacle, Center Strip Contacts, Features: Solder Retention, Packaging: Tape & Reel (TR).
Інші пропозиції BM46B-12DS-0.35V(51)
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| BM46B-12DS-0.35V(51) | Виробник : Hirose Electric Co Ltd |
Description: CONN RCPT 0.35MM SMD GOLD 12POS Number of Rows: 2 Mated Stacking Heights: 0.6mm Contact Finish Thickness: 1.18µin (0.030µm) Height Above Board: 0.024" (0.61mm) Pitch: 0.014" (0.35mm) Number of Positions: 12 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Receptacle, Center Strip Contacts Features: Solder Retention Packaging: Tape & Reel (TR) |
товару немає в наявності |
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BM46B-12DS-0.35V(51) | Виробник : Hirose Connector |
 Board to Board & Mezzanine Connectors 0.35mm Receptacle 12 POS Multi-RF B2B |
товару немає в наявності |