BM57B0.6-10DS/2-0.3V(53) Hirose Electric Co Ltd
Виробник: Hirose Electric Co Ltd
Description: CONN RCPT 0.3MM SMD 10POS + 2PWR
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 10
Pitch: 0.012" (0.30mm)
Height Above Board: 0.021" (0.55mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.6mm
Number of Rows: 2
Description: CONN RCPT 0.3MM SMD 10POS + 2PWR
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 10
Pitch: 0.012" (0.30mm)
Height Above Board: 0.021" (0.55mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.6mm
Number of Rows: 2
на замовлення 857 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна без ПДВ |
---|---|
4+ | 80.16 грн |
10+ | 65.02 грн |
25+ | 62.34 грн |
50+ | 57.25 грн |
100+ | 54.76 грн |
250+ | 49.78 грн |
500+ | 44.07 грн |
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Технічний опис BM57B0.6-10DS/2-0.3V(53) Hirose Electric Co Ltd
Description: CONN RCPT 0.3MM SMD 10POS + 2PWR, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 10, Pitch: 0.012" (0.30mm), Height Above Board: 0.021" (0.55mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.6mm, Number of Rows: 2.
Інші пропозиції BM57B0.6-10DS/2-0.3V(53)
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
---|---|---|---|---|---|
BM57B0.6-10DS/2-0.3V(53) | Виробник : HIROSE |
Category: Other Hirose Connectors Description: BM57B0.6-10DS/2-0.3V(53) кількість в упаковці: 1 шт |
товар відсутній |
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BM57B0.6-10DS/2-0.3V(53) | Виробник : Hirose Electric Co Ltd |
Description: CONN RCPT 0.3MM SMD 10POS + 2PWR Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 10 Pitch: 0.012" (0.30mm) Height Above Board: 0.021" (0.55mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.6mm Number of Rows: 2 |
товар відсутній |
||
BM57B0.6-10DS/2-0.3V(53) | Виробник : Hirose Connector | Board to Board & Mezzanine Connectors Rcpt .3mm.6mm Height 1.9mm WidthLow-Profile Hybrid |
товар відсутній |
||
BM57B0.6-10DS/2-0.3V(53) | Виробник : HIROSE |
Category: Other Hirose Connectors Description: BM57B0.6-10DS/2-0.3V(53) |
товар відсутній |