BM57B0.6-10DS/2-0.3V(53) Hirose Electric Co Ltd
Виробник: Hirose Electric Co Ltd
Description: CONN RCPT 0.3MM SMD 10POS + 2PWR
Number of Rows: 2
Mated Stacking Heights: 0.6mm
Contact Finish Thickness: 1.97µin (0.050µm)
Height Above Board: 0.021" (0.55mm)
Pitch: 0.012" (0.30mm)
Number of Positions: 10
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Receptacle, Center Strip Contacts
Features: Solder Retention
Packaging: Cut Tape (CT)
| Кількість | Ціна |
|---|---|
| 4+ | 105.22 грн |
| 10+ | 77.10 грн |
| 25+ | 69.36 грн |
| 50+ | 60.16 грн |
| 100+ | 55.65 грн |
| 250+ | 50.31 грн |
| 500+ | 45.93 грн |
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Технічний опис BM57B0.6-10DS/2-0.3V(53) Hirose Electric Co Ltd
Description: CONN RCPT 0.3MM SMD 10POS + 2PWR, Number of Rows: 2, Mated Stacking Heights: 0.6mm, Contact Finish Thickness: 1.97µin (0.050µm), Height Above Board: 0.021" (0.55mm), Pitch: 0.012" (0.30mm), Number of Positions: 10, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Receptacle, Center Strip Contacts, Features: Solder Retention, Packaging: Tape & Reel (TR).
Інші пропозиції BM57B0.6-10DS/2-0.3V(53)
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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BM57B0.6-10DS/2-0.3V(53) | Виробник : Hirose Electric Co Ltd |
Description: CONN RCPT 0.3MM SMD 10POS + 2PWR Number of Rows: 2 Mated Stacking Heights: 0.6mm Contact Finish Thickness: 1.97µin (0.050µm) Height Above Board: 0.021" (0.55mm) Pitch: 0.012" (0.30mm) Number of Positions: 10 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Receptacle, Center Strip Contacts Features: Solder Retention Packaging: Tape & Reel (TR) |
товару немає в наявності |
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BM57B0.6-10DS/2-0.3V(53) | Виробник : Hirose Connector |
Board to Board & Mezzanine Connectors Rcpt .3mm.6mm Height 1.9mm WidthLow-Profile Hybrid |
товару немає в наявності |