BSM150GB170DN2E3256HDLA1 Infineon Technologies
Виробник: Infineon Technologies
Description: IGBT MOD 1700V 300A 1250W MOD
Input Capacitance (Cies) @ Vce: 10 nF @ 25 V
Current - Collector Cutoff (Max): 300 µA
Power - Max: 1250 W
Voltage - Collector Emitter Breakdown (Max): 1700 V
Current - Collector (Ic) (Max): 300 A
Part Status: Active
Supplier Device Package: Module
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 3.2V @ 15V, 150A
Operating Temperature: 150°C (TJ)
Configuration: 2 Independent
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
| Кількість | Ціна |
|---|---|
| 2+ | 8550.24 грн |
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Технічний опис BSM150GB170DN2E3256HDLA1 Infineon Technologies
Description: IGBT MOD 1700V 300A 1250W MOD, Input Capacitance (Cies) @ Vce: 10 nF @ 25 V, Current - Collector Cutoff (Max): 300 µA, Power - Max: 1250 W, Voltage - Collector Emitter Breakdown (Max): 1700 V, Current - Collector (Ic) (Max): 300 A, Part Status: Active, Supplier Device Package: Module, NTC Thermistor: No, Vce(on) (Max) @ Vge, Ic: 3.2V @ 15V, 150A, Operating Temperature: 150°C (TJ), Configuration: 2 Independent, Input: Standard, Mounting Type: Chassis Mount, Package / Case: Module, Packaging: Bulk.