Технічний опис BSW-115-04-L-D Samtec
Description: CONN RCPT 30POS 0.1 GOLD PCB, Packaging: Bulk, Connector Type: Receptacle, Breakaway, Mounting Type: Through Hole, Bottom Mount, Number of Positions: 30, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Contact Length - Post: 0.165" (4.19mm), Insulation Height: 0.350" (8.89mm), Row Spacing - Mating: 0.100" (2.54mm), Number of Rows: 2.
Інші пропозиції BSW-115-04-L-D
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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BSW-115-04-L-D | Виробник : Samtec |
 Conn Bottom Mount Socket Strip SKT 30 POS 2.54mm Solder ST Bottom Entry Thru-Hole |
товару немає в наявності |
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BSW-115-04-L-D | Виробник : Samtec |
Conn Bottom Mount Socket Strip SKT 30 POS 2.54mm Solder ST Bottom Entry Thru-Hole |
товару немає в наявності |
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| BSW-115-04-L-D | Виробник : Samtec Inc. |
Description: CONN RCPT 30POS 0.1 GOLD PCB Packaging: Bulk Connector Type: Receptacle, Breakaway Mounting Type: Through Hole, Bottom Mount Number of Positions: 30 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Contact Length - Post: 0.165" (4.19mm) Insulation Height: 0.350" (8.89mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
товару немає в наявності |
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BSW-115-04-L-D | Виробник : Samtec |
Board to Board & Mezzanine Connectors .100" Bottom Entry Socket Strip |
товару немає в наявності |