BU160Z-178-HT On Shore Technology Inc.
Виробник: On Shore Technology Inc.
Description: CONN IC DIP SOCKET 16POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Copper
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 78.7µin (2.00µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Tube
Відгуки про товар
Написати відгук
Технічний опис BU160Z-178-HT On Shore Technology Inc.
Description: CONN IC DIP SOCKET 16POS GOLD, Contact Material - Post: Brass, Contact Finish Thickness - Post: FLASH, Contact Finish - Post: Copper, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 78.7µin (2.00µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 16 (2 x 8), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Surface Mount, Features: Open Frame, Packaging: Tube.