BU160Z-178HT On Shore Technology Inc.
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 84.26 грн |
| 10+ | 68.93 грн |
| 30+ | 63.84 грн |
| 60+ | 57.04 грн |
| 120+ | 54.31 грн |
| 270+ | 51.29 грн |
Товар під замовлення
Немає на нашому складі — привозимо зі складу постачальника після оформлення замовлення.
термін постачання:
21-31 дні (днів)
Мінімальна партія:
4 шт
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Технічний опис BU160Z-178HT On Shore Technology Inc.
Description: CONN IC DIP SOCKET 16POS GOLD, Features: Open Frame, Packaging: Tube, Mounting Type: Surface Mount, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 16 (2 x 8), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 78.7µin (2.00µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Copper, Contact Finish Thickness - Post: FLASH, Contact Material - Post: Brass.
Інші пропозиції BU160Z-178HT
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
 |
BU160Z-178-HT | On Shore Technology Inc. |
 Description: CONN IC DIP SOCKET 16POS GOLDFeatures: Open Frame Packaging: Tube Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 78.7µin (2.00µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Copper Contact Finish Thickness - Post: FLASH Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. |
| BU160Z-178-HT |
|
Виробник: On Shore Technology Inc.
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 78.7µin (2.00µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Copper
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 78.7µin (2.00µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Copper
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.