BU200Z-178-HT On-Shore Technology, Inc

Description: CONN IC DIP SOCKET 20POS GOLD, Part Status: Obsolete, Contact Material - Post: Brass, Contact Finish Thickness - Post: FLASH, Contact Finish - Post: Copper, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 78.7µin (2.00µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 20 (2 x 10), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Surface Mount, Features: Open Frame, Packaging: Bulk.