C1632X7R1H104K TDK Corporation
Виробник: TDK CorporationDescription: CAP CER 0.1UF 50V X7R 0612
Packaging: Tape & Reel (TR)
Tolerance: ±10%
Features: Low ESL (Reverse Geometry)
Voltage - Rated: 50V
Package / Case: 0612 (1632 Metric)
Temperature Coefficient: X7R
Size / Dimension: 0.063" L x 0.126" W (1.60mm x 3.20mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Bypass, Decoupling
Thickness (Max): 0.031" (0.80mm)
Capacitance: 0.1 µF
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Технічний опис C1632X7R1H104K TDK Corporation
Description: CAP CER 0.1UF 50V X7R 0612, Packaging: Tape & Reel (TR), Tolerance: ±10%, Features: Low ESL (Reverse Geometry), Voltage - Rated: 50V, Package / Case: 0612 (1632 Metric), Temperature Coefficient: X7R, Size / Dimension: 0.063" L x 0.126" W (1.60mm x 3.20mm), Mounting Type: Surface Mount, MLCC, Operating Temperature: -55°C ~ 125°C, Applications: Bypass, Decoupling, Thickness (Max): 0.031" (0.80mm), Capacitance: 0.1 µF.
Інші пропозиції C1632X7R1H104K
| Фото | Назва | Виробник | Інформація |
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C1632X7R1H104K | Виробник : TDK Corporation |
Description: CAP CER 0.1UF 50V X7R 0612 Packaging: Cut Tape (CT) Tolerance: ±10% Features: Low ESL (Reverse Geometry) Voltage - Rated: 50V Package / Case: 0612 (1632 Metric) Temperature Coefficient: X7R Size / Dimension: 0.063" L x 0.126" W (1.60mm x 3.20mm) Mounting Type: Surface Mount, MLCC Operating Temperature: -55°C ~ 125°C Applications: Bypass, Decoupling Thickness (Max): 0.031" (0.80mm) Capacitance: 0.1 µF |
товару немає в наявності |