Технічний опис C5750C0G2J683J230KE TDK
Description: CAP CER 0.068UF 630V C0GNP0 2220, Tolerance: ±5%, Features: Soft Termination, Packaging: Tape & Reel (TR), Voltage - Rated: 630V, Package / Case: 2220 (5750 Metric), Temperature Coefficient: C0G, NP0, Size / Dimension: 0.224" L x 0.197" W (5.70mm x 5.00mm), Mounting Type: Surface Mount, MLCC, Operating Temperature: -55°C ~ 125°C, Applications: Boardflex Sensitive, Thickness (Max): 0.102" (2.60mm), Part Status: Active, Capacitance: 0.068 µF.
Інші пропозиції C5750C0G2J683J230KE
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
 |
C5750C0G2J683J230KE | TDK Corporation |
 Description: CAP CER 0.068UF 630V C0GNP0 2220Tolerance: ±5% Features: Soft Termination Packaging: Tape & Reel (TR) Voltage - Rated: 630V Package / Case: 2220 (5750 Metric) Temperature Coefficient: C0G, NP0 Size / Dimension: 0.224" L x 0.197" W (5.70mm x 5.00mm) Mounting Type: Surface Mount, MLCC Operating Temperature: -55°C ~ 125°C Applications: Boardflex Sensitive Thickness (Max): 0.102" (2.60mm) Part Status: Active Capacitance: 0.068 µF |
товару немає в наявності |
Мінімальне замовлення: 500 шт В кошику од. на суму грн. |
|
|
C5750C0G2J683J230KE | TDK Corporation |
Description: CAP CER 0.068UF 630V C0GNP0 2220 Packaging: Cut Tape (CT) Tolerance: ±5% Features: Soft Termination Voltage - Rated: 630V Package / Case: 2220 (5750 Metric) Temperature Coefficient: C0G, NP0 Size / Dimension: 0.224" L x 0.197" W (5.70mm x 5.00mm) Mounting Type: Surface Mount, MLCC Operating Temperature: -55°C ~ 125°C Applications: Boardflex Sensitive Thickness (Max): 0.102" (2.60mm) Part Status: Active Capacitance: 0.068 µF |
товару немає в наявності |
В кошику од. на суму грн. |
| C5750C0G2J683J230KE |
|
Виробник: TDK Corporation
Description: CAP CER 0.068UF 630V C0GNP0 2220
Tolerance: ±5%
Features: Soft Termination
Packaging: Tape & Reel (TR)
Voltage - Rated: 630V
Package / Case: 2220 (5750 Metric)
Temperature Coefficient: C0G, NP0
Size / Dimension: 0.224" L x 0.197" W (5.70mm x 5.00mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Boardflex Sensitive
Thickness (Max): 0.102" (2.60mm)
Part Status: Active
Capacitance: 0.068 µF
Description: CAP CER 0.068UF 630V C0GNP0 2220
Tolerance: ±5%
Features: Soft Termination
Packaging: Tape & Reel (TR)
Voltage - Rated: 630V
Package / Case: 2220 (5750 Metric)
Temperature Coefficient: C0G, NP0
Size / Dimension: 0.224" L x 0.197" W (5.70mm x 5.00mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Boardflex Sensitive
Thickness (Max): 0.102" (2.60mm)
Part Status: Active
Capacitance: 0.068 µF
товару немає в наявності
Мінімальне замовлення: 500 шт
В кошику
од. на суму грн.
| C5750C0G2J683J230KE |
|
Виробник: TDK Corporation
Description: CAP CER 0.068UF 630V C0GNP0 2220
Packaging: Cut Tape (CT)
Tolerance: ±5%
Features: Soft Termination
Voltage - Rated: 630V
Package / Case: 2220 (5750 Metric)
Temperature Coefficient: C0G, NP0
Size / Dimension: 0.224" L x 0.197" W (5.70mm x 5.00mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Boardflex Sensitive
Thickness (Max): 0.102" (2.60mm)
Part Status: Active
Capacitance: 0.068 µF
Description: CAP CER 0.068UF 630V C0GNP0 2220
Packaging: Cut Tape (CT)
Tolerance: ±5%
Features: Soft Termination
Voltage - Rated: 630V
Package / Case: 2220 (5750 Metric)
Temperature Coefficient: C0G, NP0
Size / Dimension: 0.224" L x 0.197" W (5.70mm x 5.00mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Boardflex Sensitive
Thickness (Max): 0.102" (2.60mm)
Part Status: Active
Capacitance: 0.068 µF
товару немає в наявності
В кошику
од. на суму грн.