CL21B224KBFSFNE Samsung Electro-Mechanics
Виробник: Samsung Electro-Mechanics
Description: CAP CER 0.22UF 50V X7R 0805
Capacitance: 0.22 µF
Thickness (Max): 0.053" (1.35mm)
Applications: Boardflex Sensitive
Operating Temperature: -55°C ~ 125°C
Mounting Type: Surface Mount, MLCC
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
Temperature Coefficient: X7R
Package / Case: 0805 (2012 Metric)
Voltage - Rated: 50V
Features: Soft Termination
Tolerance: ±10%
Packaging: Tape & Reel (TR)
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Технічний опис CL21B224KBFSFNE Samsung Electro-Mechanics
Description: CAP CER 0.22UF 50V X7R 0805, Capacitance: 0.22 µF, Thickness (Max): 0.053" (1.35mm), Applications: Boardflex Sensitive, Operating Temperature: -55°C ~ 125°C, Mounting Type: Surface Mount, MLCC, Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm), Temperature Coefficient: X7R, Package / Case: 0805 (2012 Metric), Voltage - Rated: 50V, Features: Soft Termination, Tolerance: ±10%, Packaging: Tape & Reel (TR).
Інші пропозиції CL21B224KBFSFNE
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CL21B224KBFSFNE | Виробник : Samsung Electro-Mechanics |
Description: CAP CER 0.22UF 50V X7R 0805 Temperature Coefficient: X7R Package / Case: 0805 (2012 Metric) Voltage - Rated: 50V Features: Soft Termination Tolerance: ±10% Packaging: Cut Tape (CT) Capacitance: 0.22 µF Thickness (Max): 0.053" (1.35mm) Applications: Boardflex Sensitive Operating Temperature: -55°C ~ 125°C Mounting Type: Surface Mount, MLCC Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm) |
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