CL31B104KEHSW6E

CL31B104KEHSW6E Samsung Electro-Mechanics


MLCC.pdf Виробник: Samsung Electro-Mechanics
Description: CAP CER 0.1UF 250V X7R 1206
Packaging: Tape & Reel (TR)
Tolerance: ±10%
Features: Soft Termination
Voltage - Rated: 250V
Package / Case: 1206 (3216 Metric)
Temperature Coefficient: X7R
Size / Dimension: 0.126" L x 0.063" W (3.20mm x 1.60mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Boardflex Sensitive
Thickness (Max): 0.071" (1.80mm)
Capacitance: 0.1 µF
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Технічний опис CL31B104KEHSW6E Samsung Electro-Mechanics

Description: CAP CER 0.1UF 250V X7R 1206, Packaging: Tape & Reel (TR), Tolerance: ±10%, Features: Soft Termination, Voltage - Rated: 250V, Package / Case: 1206 (3216 Metric), Temperature Coefficient: X7R, Size / Dimension: 0.126" L x 0.063" W (3.20mm x 1.60mm), Mounting Type: Surface Mount, MLCC, Operating Temperature: -55°C ~ 125°C, Applications: Boardflex Sensitive, Thickness (Max): 0.071" (1.80mm), Capacitance: 0.1 µF.

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CL31B104KEHSW6E CL31B104KEHSW6E Виробник : Samsung Electro-Mechanics MLCC.pdf Description: CAP CER 0.1UF 250V X7R 1206
Packaging: Cut Tape (CT)
Tolerance: ±10%
Features: Soft Termination
Voltage - Rated: 250V
Package / Case: 1206 (3216 Metric)
Temperature Coefficient: X7R
Size / Dimension: 0.126" L x 0.063" W (3.20mm x 1.60mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Boardflex Sensitive
Thickness (Max): 0.071" (1.80mm)
Capacitance: 0.1 µF
товар відсутній