CLE-115-01-G-DV Samtec
Виробник: Samtec
Headers & Wire Housings 0.80 mm Tiger Beam(TM) Cost-effective Single Beam Socket Strip
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 455.77 грн |
| 25+ | 409.64 грн |
| 47+ | 355.48 грн |
| 94+ | 335.69 грн |
Товар під замовлення
Немає на нашому складі — привозимо зі складу постачальника після оформлення замовлення.
термін постачання:
31-40 дні (днів)
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Технічний опис CLE-115-01-G-DV Samtec
Description: CONN RCPT 30POS 0.031 GOLD SMD, Packaging: Bulk, Connector Type: Receptacle, Pass Through, Current Rating (Amps): 2.7A per Contact, Mounting Type: Surface Mount, Number of Positions: 30, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.031" (0.80mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Gold, Insulation Height: 0.130" (3.30mm), Row Spacing - Mating: 0.047" (1.20mm), Number of Rows: 2.
Інші пропозиції CLE-115-01-G-DV
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
 |
CLE-115-01-G-DV | Samtec Inc. |
Description: CONN RCPT 30POS 0.031 GOLD SMD Packaging: Bulk Connector Type: Receptacle, Pass Through Current Rating (Amps): 2.7A per Contact Mounting Type: Surface Mount Number of Positions: 30 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.031" (0.80mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Insulation Height: 0.130" (3.30mm) Row Spacing - Mating: 0.047" (1.20mm) Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. |
 |
CLE-115-01-G-DV | SAMTEC |
Description: SAMTEC - CLE-115-01-G-DV - Printbuchse, Board-to-Board, 0.8 mm, 2 Reihe(n), 30 Kontakt(e), Oberflächenmontage Kontaktüberzug: Vergoldete Kontakte Kontaktanschluss: Oberflächenmontage Rastermaß: 0.8 Anzahl der Kontakte: 30 Steckverbindersysteme: Board-to-Board Anzahl der Reihen: 2 Kontaktmaterial: Beryllium-Kupfer Steckverbindermontage: Oberflächenmontage Produktpalette: Tiger Beam CLE SVHC: No SVHC (10-Jun-2022) |
товару немає в наявності |
В кошику од. на суму грн. |
| CLE-115-01-G-DV |
|
Виробник: Samtec Inc.
Description: CONN RCPT 30POS 0.031 GOLD SMD
Packaging: Bulk
Connector Type: Receptacle, Pass Through
Current Rating (Amps): 2.7A per Contact
Mounting Type: Surface Mount
Number of Positions: 30
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.031" (0.80mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Insulation Height: 0.130" (3.30mm)
Row Spacing - Mating: 0.047" (1.20mm)
Number of Rows: 2
Description: CONN RCPT 30POS 0.031 GOLD SMD
Packaging: Bulk
Connector Type: Receptacle, Pass Through
Current Rating (Amps): 2.7A per Contact
Mounting Type: Surface Mount
Number of Positions: 30
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.031" (0.80mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Insulation Height: 0.130" (3.30mm)
Row Spacing - Mating: 0.047" (1.20mm)
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| CLE-115-01-G-DV |
|
Виробник: SAMTEC
Description: SAMTEC - CLE-115-01-G-DV - Printbuchse, Board-to-Board, 0.8 mm, 2 Reihe(n), 30 Kontakt(e), Oberflächenmontage
Kontaktüberzug: Vergoldete Kontakte
Kontaktanschluss: Oberflächenmontage
Rastermaß: 0.8
Anzahl der Kontakte: 30
Steckverbindersysteme: Board-to-Board
Anzahl der Reihen: 2
Kontaktmaterial: Beryllium-Kupfer
Steckverbindermontage: Oberflächenmontage
Produktpalette: Tiger Beam CLE
SVHC: No SVHC (10-Jun-2022)
Description: SAMTEC - CLE-115-01-G-DV - Printbuchse, Board-to-Board, 0.8 mm, 2 Reihe(n), 30 Kontakt(e), Oberflächenmontage
Kontaktüberzug: Vergoldete Kontakte
Kontaktanschluss: Oberflächenmontage
Rastermaß: 0.8
Anzahl der Kontakte: 30
Steckverbindersysteme: Board-to-Board
Anzahl der Reihen: 2
Kontaktmaterial: Beryllium-Kupfer
Steckverbindermontage: Oberflächenmontage
Produktpalette: Tiger Beam CLE
SVHC: No SVHC (10-Jun-2022)
товару немає в наявності
В кошику
од. на суму грн.