CLM-107-02-H-D Samtec Inc.
Виробник: Samtec Inc.
Description: CONN RCPT 14POS 0.039 GOLD SMD
Number of Rows: 2
Row Spacing - Mating: 0.039" (1.00mm)
Insulation Height: 0.084" (2.14mm)
Part Status: Active
Contact Finish - Post: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.039" (1.00mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 14
Mounting Type: Surface Mount
Current Rating (Amps): 2.8A per Contact
Connector Type: Receptacle
Packaging: Tube
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Технічний опис CLM-107-02-H-D Samtec Inc.
Description: CONN RCPT 14POS 0.039 GOLD SMD, Number of Rows: 2, Row Spacing - Mating: 0.039" (1.00mm), Insulation Height: 0.084" (2.14mm), Part Status: Active, Contact Finish - Post: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.039" (1.00mm), Insulation Color: Black, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Female Socket, Operating Temperature: -55°C ~ 125°C, Style: Board to Board, Number of Positions: 14, Mounting Type: Surface Mount, Current Rating (Amps): 2.8A per Contact, Connector Type: Receptacle, Packaging: Tube.
Інші пропозиції CLM-107-02-H-D
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
 |
CLM-107-02-H-D | Samtec |
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch |
товару немає в наявності |
В кошику од. на суму грн. |
| CLM-107-02-H-D |
|
Виробник: Samtec
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
товару немає в наявності
В кошику
од. на суму грн.