CLM-109-02-F-D Samtec Inc.
Виробник: Samtec Inc.
Description: CONN RCPT 18POS 0.039 GOLD SMD
Number of Rows: 2
Row Spacing - Mating: 0.039" (1.00mm)
Insulation Height: 0.084" (2.14mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.039" (1.00mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 18
Mounting Type: Surface Mount
Current Rating (Amps): 2.8A per Contact
Connector Type: Receptacle
Packaging: Tube
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 203.03 грн |
| 10+ | 165.88 грн |
| 100+ | 140.96 грн |
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Технічний опис CLM-109-02-F-D Samtec Inc.
Description: CONN RCPT 18POS 0.039 GOLD SMD, Number of Rows: 2, Row Spacing - Mating: 0.039" (1.00mm), Insulation Height: 0.084" (2.14mm), Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.039" (1.00mm), Insulation Color: Black, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Female Socket, Operating Temperature: -55°C ~ 125°C, Style: Board to Board, Number of Positions: 18, Mounting Type: Surface Mount, Current Rating (Amps): 2.8A per Contact, Connector Type: Receptacle, Packaging: Tube.
Інші пропозиції CLM-109-02-F-D
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
 |
CLM-109-02-F-D | Samtec |
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket |
на замовлення 61 шт: термін постачання 21-30 дні (днів) |
В кошику од. на суму грн. |
| CLM-109-02-F-D |
|
Виробник: Samtec
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket
на замовлення 61 шт:
термін постачання 21-30 дні (днів)