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CLM-122-02-H-D-BE-PA

CLM-122-02-H-D-BE-PA Samtec Inc.


clm_sm.pdf
Виробник: Samtec Inc.
Description: CONN RCPT 44POS 0.039 GOLD SMD
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 44
Mounting Type: Surface Mount
Current Rating (Amps): 2.8A per Contact
Connector Type: Receptacle, Bottom Entry
Features: Pick and Place
Packaging: Tray
Number of Rows: 2
Row Spacing - Mating: 0.039" (1.00mm)
Insulation Height: 0.084" (2.14mm)
Part Status: Active
Contact Finish - Post: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.039" (1.00mm)
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Технічний опис CLM-122-02-H-D-BE-PA Samtec Inc.

Description: CONN RCPT 44POS 0.039 GOLD SMD, Insulation Color: Black, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Female Socket, Operating Temperature: -55°C ~ 125°C, Style: Board to Board, Number of Positions: 44, Mounting Type: Surface Mount, Current Rating (Amps): 2.8A per Contact, Connector Type: Receptacle, Bottom Entry, Features: Pick and Place, Packaging: Tray, Number of Rows: 2, Row Spacing - Mating: 0.039" (1.00mm), Insulation Height: 0.084" (2.14mm), Part Status: Active, Contact Finish - Post: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.039" (1.00mm).

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CLM-122-02-H-D-BE-PA CLM-122-02-H-D-BE-PA Samtec clm_sm-2853999.pdf Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
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CLM-122-02-H-D-BE-PA clm_sm-2853999.pdf
CLM-122-02-H-D-BE-PA
Виробник: Samtec
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
товару немає в наявності
В кошику  од. на суму  грн.