Технічний опис CLM-136-02-L-D-PA Samtec
Description: CONN RCPT 72POS 0.039 GOLD SMD, Packaging: Tray, Features: Pick and Place, Connector Type: Receptacle, Current Rating (Amps): 2.8A per Contact, Mounting Type: Surface Mount, Number of Positions: 72, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Part Status: Active, Insulation Height: 0.084" (2.14mm), Row Spacing - Mating: 0.039" (1.00mm), Number of Rows: 2.
Інші пропозиції CLM-136-02-L-D-PA
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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CLM-136-02-L-D-PA | Виробник : Samtec |
 Conn Socket Strip SKT 72 POS 1mm Solder ST SMD Tray |
товару немає в наявності |
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CLM-136-02-L-D-PA | Виробник : Samtec Inc. |
Description: CONN RCPT 72POS 0.039 GOLD SMD Packaging: Tray Features: Pick and Place Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 72 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 |
товару немає в наявності |
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CLM-136-02-L-D-PA | Виробник : Samtec |
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch |
товару немає в наявності |