Технічний опис CLP-102-02-F-D-K Samtec
Description: LOW PROFILE DUAL-WIPE SOCKET, 0., Packaging: Tube, Features: Pick and Place, Connector Type: Receptacle, Voltage Rating: 240VAC, 330VDC, Current Rating (Amps): 3.3A per Contact, Mounting Type: Surface Mount, Number of Positions: 4, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Insulation Height: 0.084" (2.14mm), Row Spacing - Mating: 0.050" (1.27mm), Number of Rows: 2.
Інші пропозиції CLP-102-02-F-D-K
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| CLP-102-02-F-D-K | Виробник : Samtec |
 Low Profile Dual-Wipe Socket, 0.050Inch Pitch |
товару немає в наявності |
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| CLP-102-02-F-D-K | Виробник : Samtec Inc. |
Description: LOW PROFILE DUAL-WIPE SOCKET, 0. Packaging: Tube Features: Pick and Place Connector Type: Receptacle Voltage Rating: 240VAC, 330VDC Current Rating (Amps): 3.3A per Contact Mounting Type: Surface Mount Number of Positions: 4 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.050" (1.27mm) Number of Rows: 2 |
товару немає в наявності |