Технічний опис CLP-102-02-LM-DH Samtec
Description: CONN RCPT 4POS 0.05 GOLD SMD R/A, Packaging: Bulk, Connector Type: Receptacle, Voltage Rating: 240VAC, 330VDC, Current Rating (Amps): 3.3A per Contact, Mounting Type: Surface Mount, Right Angle, Number of Positions: 4, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Insulation Height: 0.135" (3.43mm), Row Spacing - Mating: 0.050" (1.27mm), Number of Rows: 2.
Інші пропозиції CLP-102-02-LM-DH
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
---|---|---|---|---|---|
![]() |
CLP-102-02-LM-DH | Виробник : Samtec |
![]() |
товару немає в наявності |
|
![]() |
CLP-102-02-LM-DH | Виробник : Samtec Inc. |
Description: CONN RCPT 4POS 0.05 GOLD SMD R/A Packaging: Bulk Connector Type: Receptacle Voltage Rating: 240VAC, 330VDC Current Rating (Amps): 3.3A per Contact Mounting Type: Surface Mount, Right Angle Number of Positions: 4 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Insulation Height: 0.135" (3.43mm) Row Spacing - Mating: 0.050" (1.27mm) Number of Rows: 2 |
товару немає в наявності |
|
![]() |
CLP-102-02-LM-DH | Виробник : Samtec |
![]() |
товару немає в наявності |