CLP-103-02-F-S Samtec Inc.
Виробник: Samtec Inc.
Description: CONN RCPT 3POS 0.05 GOLD SMD
Number of Rows: 1
Insulation Height: 0.084" (2.14mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 3
Mounting Type: Surface Mount
Current Rating (Amps): 3.3A per Contact
Voltage Rating: 240VAC, 330VDC
Connector Type: Receptacle
Packaging: Bulk
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Технічний опис CLP-103-02-F-S Samtec Inc.
Description: CONN RCPT 3POS 0.05 GOLD SMD, Number of Rows: 1, Insulation Height: 0.084" (2.14mm), Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm), Insulation Color: Black, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Female Socket, Operating Temperature: -55°C ~ 125°C, Style: Board to Board, Number of Positions: 3, Mounting Type: Surface Mount, Current Rating (Amps): 3.3A per Contact, Voltage Rating: 240VAC, 330VDC, Connector Type: Receptacle, Packaging: Bulk.
Інші пропозиції CLP-103-02-F-S
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
|---|---|---|---|---|---|
 |
CLP-103-02-F-S | Samtec |
Headers & Wire Housings Low Profile Dual-Wipe Socket, .050" Pitch |
товару немає в наявності |
Мінімальне замовлення: 4 шт В кошику од. на суму грн. |
| CLP-103-02-F-S |
|
Виробник: Samtec
Headers & Wire Housings Low Profile Dual-Wipe Socket, .050" Pitch
Headers & Wire Housings Low Profile Dual-Wipe Socket, .050" Pitch
товару немає в наявності
Мінімальне замовлення: 4 шт
В кошику
од. на суму грн.