Технічний опис CLP-104-02-G-D-K Samtec
Description: LOW PROFILE DUAL-WIPE SOCKET, 0., Packaging: Tube, Part Status: Active, Features: Pick and Place, Connector Type: Receptacle, Voltage Rating: 240VAC, 330VDC, Current Rating (Amps): 3.3A per Contact, Mounting Type: Surface Mount, Number of Positions: 8, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Gold, Insulation Height: 0.084" (2.14mm), Row Spacing - Mating: 0.050" (1.27mm), Number of Rows: 2.
Інші пропозиції CLP-104-02-G-D-K
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
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CLP-104-02-G-D-K | Виробник : Samtec |
 Conn Socket Strip SKT 8 POS 1.27mm Solder ST SMD |
товару немає в наявності |
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| CLP-104-02-G-D-K | Виробник : Samtec Inc. |
Description: LOW PROFILE DUAL-WIPE SOCKET, 0. Packaging: Tube Part Status: Active Features: Pick and Place Connector Type: Receptacle Voltage Rating: 240VAC, 330VDC Current Rating (Amps): 3.3A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.050" (1.27mm) Number of Rows: 2 |
товару немає в наявності |
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CLP-104-02-G-D-K | Виробник : Samtec |
Headers & Wire Housings Low Profile Dual-Wipe Socket, .050" Pitch |
товару немає в наявності |