CLP-105-02-F-D-A Samtec Inc.
Виробник: Samtec Inc.Description: CONN RCPT 10POS 0.05 GOLD SMD
Features: Board Guide
Packaging: Tube
Connector Type: Receptacle
Voltage Rating: 240VAC, 330VDC
Current Rating (Amps): 3.3A per Contact
Mounting Type: Surface Mount
Number of Positions: 10
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
на замовлення 7758 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 2+ | 222.78 грн |
| 10+ | 194.65 грн |
| 100+ | 171.50 грн |
| 500+ | 136.80 грн |
| 1000+ | 116.68 грн |
| 5000+ | 104.61 грн |
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Технічний опис CLP-105-02-F-D-A Samtec Inc.
Description: CONN RCPT 10POS 0.05 GOLD SMD, Features: Board Guide, Packaging: Tube, Connector Type: Receptacle, Voltage Rating: 240VAC, 330VDC, Current Rating (Amps): 3.3A per Contact, Mounting Type: Surface Mount, Number of Positions: 10, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Part Status: Active, Insulation Height: 0.084" (2.14mm), Row Spacing - Mating: 0.050" (1.27mm), Number of Rows: 2.
Інші пропозиції CLP-105-02-F-D-A за ціною від 106.92 грн до 241.95 грн
| Фото | Назва | Виробник | Інформація |
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CLP-105-02-F-D-A | Виробник : Samtec |
Headers & Wire Housings Low Profile Dual-Wipe Socket, .050" Pitch |
на замовлення 313 шт: термін постачання 21-30 дні (днів) |
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