CLP-107-02-G-D-K-TR Samtec Inc.
Виробник: Samtec Inc.
Description: CONN RCPT 14POS 0.05 GOLD SMD
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Insulation Height: 0.084" (2.14mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 14
Mounting Type: Surface Mount
Current Rating (Amps): 3.3A per Contact
Voltage Rating: 240VAC, 330VDC
Connector Type: Receptacle
Features: Pick and Place
Packaging: Tape & Reel (TR)
| Кількість | Ціна без ПДВ |
|---|---|
| 1600+ | 116.87 грн |
| 3200+ | 95.22 грн |
Відгуки про товар
Написати відгук
Технічний опис CLP-107-02-G-D-K-TR Samtec Inc.
Description: CONN RCPT 14POS 0.05 GOLD SMD, Number of Rows: 2, Row Spacing - Mating: 0.050" (1.27mm), Insulation Height: 0.084" (2.14mm), Contact Finish - Post: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm), Insulation Color: Black, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Female Socket, Operating Temperature: -55°C ~ 125°C, Style: Board to Board, Number of Positions: 14, Mounting Type: Surface Mount, Current Rating (Amps): 3.3A per Contact, Voltage Rating: 240VAC, 330VDC, Connector Type: Receptacle, Features: Pick and Place, Packaging: Tape & Reel (TR).
Інші пропозиції CLP-107-02-G-D-K-TR за ціною від 121.93 грн до 232.99 грн
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
CLP-107-02-G-D-K-TR | Samtec Inc. |
Description: CONN RCPT 14POS 0.05 GOLD SMDNumber of Rows: 2 Row Spacing - Mating: 0.050" (1.27mm) Insulation Height: 0.084" (2.14mm) Contact Finish - Post: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.050" (1.27mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 14 Mounting Type: Surface Mount Current Rating (Amps): 3.3A per Contact Voltage Rating: 240VAC, 330VDC Connector Type: Receptacle Features: Pick and Place Packaging: Cut Tape (CT) |
на замовлення 3791 шт: термін постачання 21-31 дні (днів) |
|
||||||||
|
CLP-107-02-G-D-K-TR | Samtec |
Headers & Wire Housings Low Profile Dual-Wipe Socket |
на замовлення 1810 шт: термін постачання 21-30 дні (днів) |
В кошику од. на суму грн. | ||||||||
|
CLP-107-02-G-D-K-TR | SAMTEC |
Description: SAMTEC - CLP-107-02-G-D-K-TR - Printbuchse, Board-to-Board, 1.27 mm, 2 Reihe(n), 14 Kontakt(e), Oberflächenmontage, CLPtariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze isCanonical: Y Steckverbindermontage: Oberflächenmontage Anzahl der Kontakte: 14Kontakt(e) SVHC: No SVHC (04-Feb-2026) Steckverbindersysteme: Board-to-Board Produktpalette: CLP productTraceability: No Kontaktanschluss: Oberflächenmontage usEccn: EAR99 Anzahl der Reihen: 2Reihe(n) Rastermaß: 1.27mm |
на замовлення 29 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. |
| CLP-107-02-G-D-K-TR |
![]() |
Виробник: Samtec Inc.
Description: CONN RCPT 14POS 0.05 GOLD SMD
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Insulation Height: 0.084" (2.14mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 14
Mounting Type: Surface Mount
Current Rating (Amps): 3.3A per Contact
Voltage Rating: 240VAC, 330VDC
Connector Type: Receptacle
Features: Pick and Place
Packaging: Cut Tape (CT)
Description: CONN RCPT 14POS 0.05 GOLD SMD
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Insulation Height: 0.084" (2.14mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 14
Mounting Type: Surface Mount
Current Rating (Amps): 3.3A per Contact
Voltage Rating: 240VAC, 330VDC
Connector Type: Receptacle
Features: Pick and Place
Packaging: Cut Tape (CT)
на замовлення 3791 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 232.99 грн |
| 50+ | 189.38 грн |
| 100+ | 158.95 грн |
| 500+ | 121.93 грн |
| CLP-107-02-G-D-K-TR |
![]() |
Виробник: Samtec
Headers & Wire Housings Low Profile Dual-Wipe Socket
Headers & Wire Housings Low Profile Dual-Wipe Socket
на замовлення 1810 шт:
термін постачання 21-30 дні (днів)
| CLP-107-02-G-D-K-TR |
![]() |
Виробник: SAMTEC
Description: SAMTEC - CLP-107-02-G-D-K-TR - Printbuchse, Board-to-Board, 1.27 mm, 2 Reihe(n), 14 Kontakt(e), Oberflächenmontage, CLP
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Steckverbindermontage: Oberflächenmontage
Anzahl der Kontakte: 14Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Board-to-Board
Produktpalette: CLP
productTraceability: No
Kontaktanschluss: Oberflächenmontage
usEccn: EAR99
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 1.27mm
Description: SAMTEC - CLP-107-02-G-D-K-TR - Printbuchse, Board-to-Board, 1.27 mm, 2 Reihe(n), 14 Kontakt(e), Oberflächenmontage, CLP
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Steckverbindermontage: Oberflächenmontage
Anzahl der Kontakte: 14Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Board-to-Board
Produktpalette: CLP
productTraceability: No
Kontaktanschluss: Oberflächenmontage
usEccn: EAR99
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 1.27mm
на замовлення 29 шт:
термін постачання 21-31 дні (днів)




