CLP-108-02-F-D-BE SAMTEC
Виробник: SAMTEC
Category: Board-to-board connectors
Description: Connector: pin strips; socket; female; PIN: 16; vertical; SMT; 2x8
Kind of connector: female
Contact plating: gold flash
Type of connector: pin strips
Electrical mounting: SMT
Connector: socket
Contacts pitch: 1.27mm
Number of pins: 16
Connector pinout layout: 2x8
Spatial orientation: vertical
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Технічний опис CLP-108-02-F-D-BE SAMTEC
Description: CONN RCPT 16POS 0.05 GOLD SMD, Packaging: Tube, Connector Type: Receptacle, Bottom Entry, Voltage Rating: 240VAC, 330VDC, Current Rating (Amps): 3.3A per Contact, Mounting Type: Surface Mount, Number of Positions: 16, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Insulation Height: 0.084" (2.14mm), Row Spacing - Mating: 0.050" (1.27mm), Number of Rows: 2.
Інші пропозиції CLP-108-02-F-D-BE за ціною від 268.92 грн до 307.89 грн
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||
|---|---|---|---|---|---|---|---|---|---|
|
CLP-108-02-F-D-BE | Samtec Inc. |
Description: CONN RCPT 16POS 0.05 GOLD SMDPackaging: Tube Connector Type: Receptacle, Bottom Entry Voltage Rating: 240VAC, 330VDC Current Rating (Amps): 3.3A per Contact Mounting Type: Surface Mount Number of Positions: 16 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.050" (1.27mm) Number of Rows: 2 |
на замовлення 45 шт: термін постачання 21-31 дні (днів) |
|
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|
CLP-108-02-F-D-BE | Samtec |
Headers & Wire Housings Low Profile Dual-Wipe Socket |
на замовлення 291 шт: термін постачання 21-30 дні (днів) |
В кошику од. на суму грн. | ||||
|
CLP-108-02-F-D-BE | SAMTEC |
Description: SAMTEC - CLP-108-02-F-D-BE - Printbuchse, Board-to-Board, 1.27 mm, 2 Reihe(n), 16 Kontakt(e), Oberflächenmontage, CLPtariffCode: 85366930 productTraceability: No Kontaktüberzug: Vergoldete Kontakte rohsCompliant: YES Rastermaß: 1.27mm Anzahl der Kontakte: 16Kontakt(e) euEccn: NLR Steckverbindersysteme: Board-to-Board Anzahl der Reihen: 2Reihe(n) Kontaktmaterial: Phosphorbronze hazardous: false rohsPhthalatesCompliant: YES usEccn: EAR99 Steckverbindermontage: Oberflächenmontage Produktpalette: CLP SVHC: No SVHC (25-Jun-2025) |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. |
| CLP-108-02-F-D-BE |
![]() |
Виробник: Samtec Inc.
Description: CONN RCPT 16POS 0.05 GOLD SMD
Packaging: Tube
Connector Type: Receptacle, Bottom Entry
Voltage Rating: 240VAC, 330VDC
Current Rating (Amps): 3.3A per Contact
Mounting Type: Surface Mount
Number of Positions: 16
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
Description: CONN RCPT 16POS 0.05 GOLD SMD
Packaging: Tube
Connector Type: Receptacle, Bottom Entry
Voltage Rating: 240VAC, 330VDC
Current Rating (Amps): 3.3A per Contact
Mounting Type: Surface Mount
Number of Positions: 16
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
на замовлення 45 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 307.89 грн |
| 10+ | 268.92 грн |
| CLP-108-02-F-D-BE |
![]() |
Виробник: Samtec
Headers & Wire Housings Low Profile Dual-Wipe Socket
Headers & Wire Housings Low Profile Dual-Wipe Socket
на замовлення 291 шт:
термін постачання 21-30 дні (днів)
| CLP-108-02-F-D-BE |
![]() |
Виробник: SAMTEC
Description: SAMTEC - CLP-108-02-F-D-BE - Printbuchse, Board-to-Board, 1.27 mm, 2 Reihe(n), 16 Kontakt(e), Oberflächenmontage, CLP
tariffCode: 85366930
productTraceability: No
Kontaktüberzug: Vergoldete Kontakte
rohsCompliant: YES
Rastermaß: 1.27mm
Anzahl der Kontakte: 16Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Anzahl der Reihen: 2Reihe(n)
Kontaktmaterial: Phosphorbronze
hazardous: false
rohsPhthalatesCompliant: YES
usEccn: EAR99
Steckverbindermontage: Oberflächenmontage
Produktpalette: CLP
SVHC: No SVHC (25-Jun-2025)
Description: SAMTEC - CLP-108-02-F-D-BE - Printbuchse, Board-to-Board, 1.27 mm, 2 Reihe(n), 16 Kontakt(e), Oberflächenmontage, CLP
tariffCode: 85366930
productTraceability: No
Kontaktüberzug: Vergoldete Kontakte
rohsCompliant: YES
Rastermaß: 1.27mm
Anzahl der Kontakte: 16Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Anzahl der Reihen: 2Reihe(n)
Kontaktmaterial: Phosphorbronze
hazardous: false
rohsPhthalatesCompliant: YES
usEccn: EAR99
Steckverbindermontage: Oberflächenmontage
Produktpalette: CLP
SVHC: No SVHC (25-Jun-2025)
на замовлення 11 шт:
термін постачання 21-31 дні (днів)





