CLP-108-02-G-D-K-TR Samtec Inc.
Виробник: Samtec Inc.
Description: CONN RCPT 16POS 0.05 GOLD SMD
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Insulation Height: 0.084" (2.14mm)
Part Status: Active
Contact Finish - Post: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 16
Connector Type: Receptacle
Features: Pick and Place
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Current Rating (Amps): 3.3A per Contact
Voltage Rating: 240VAC, 330VDC
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Технічний опис CLP-108-02-G-D-K-TR Samtec Inc.
Description: CONN RCPT 16POS 0.05 GOLD SMD, Number of Rows: 2, Row Spacing - Mating: 0.050" (1.27mm), Insulation Height: 0.084" (2.14mm), Part Status: Active, Contact Finish - Post: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm), Insulation Color: Black, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Female Socket, Operating Temperature: -55°C ~ 125°C, Style: Board to Board, Number of Positions: 16, Connector Type: Receptacle, Features: Pick and Place, Packaging: Tape & Reel (TR), Mounting Type: Surface Mount, Current Rating (Amps): 3.3A per Contact, Voltage Rating: 240VAC, 330VDC.
Інші пропозиції CLP-108-02-G-D-K-TR за ціною від 132.69 грн до 225.50 грн
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
CLP-108-02-G-D-K-TR | Samtec Inc. |
Description: CONN RCPT 16POS 0.05 GOLD SMDFeatures: Pick and Place Packaging: Cut Tape (CT) Connector Type: Receptacle Voltage Rating: 240VAC, 330VDC Current Rating (Amps): 3.3A per Contact Mounting Type: Surface Mount Number of Positions: 16 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.050" (1.27mm) Number of Rows: 2 |
на замовлення 1712 шт: термін постачання 21-31 дні (днів) |
|
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|
CLP-108-02-G-D-K-TR | Samtec |
Headers & Wire Housings Low Profile Dual-Wipe Socket |
на замовлення 169 шт: термін постачання 21-30 дні (днів) |
В кошику од. на суму грн. |
| CLP-108-02-G-D-K-TR |
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Виробник: Samtec Inc.
Description: CONN RCPT 16POS 0.05 GOLD SMD
Features: Pick and Place
Packaging: Cut Tape (CT)
Connector Type: Receptacle
Voltage Rating: 240VAC, 330VDC
Current Rating (Amps): 3.3A per Contact
Mounting Type: Surface Mount
Number of Positions: 16
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
Description: CONN RCPT 16POS 0.05 GOLD SMD
Features: Pick and Place
Packaging: Cut Tape (CT)
Connector Type: Receptacle
Voltage Rating: 240VAC, 330VDC
Current Rating (Amps): 3.3A per Contact
Mounting Type: Surface Mount
Number of Positions: 16
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
на замовлення 1712 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 225.50 грн |
| 25+ | 203.27 грн |
| 50+ | 186.81 грн |
| 100+ | 153.49 грн |
| 500+ | 132.69 грн |
| CLP-108-02-G-D-K-TR |
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Виробник: Samtec
Headers & Wire Housings Low Profile Dual-Wipe Socket
Headers & Wire Housings Low Profile Dual-Wipe Socket
на замовлення 169 шт:
термін постачання 21-30 дні (днів)



