Технічний опис CLP-110-02-F-DH Samtec
Description: CONN RCPT 20P 0.05 GOLD SMD R/A, Packaging: Tube, Connector Type: Receptacle, Voltage Rating: 240VAC, 330VDC, Current Rating (Amps): 3.3A per Contact, Mounting Type: Surface Mount, Right Angle, Number of Positions: 20, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Part Status: Active, Insulation Height: 0.135" (3.43mm), Row Spacing - Mating: 0.050" (1.27mm), Number of Rows: 2.
Інші пропозиції CLP-110-02-F-DH за ціною від 362.35 грн до 475.30 грн
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
 |
CLP-110-02-F-DH | Samtec Inc. |
 Description: CONN RCPT 20P 0.05 GOLD SMD R/APackaging: Tube Connector Type: Receptacle Voltage Rating: 240VAC, 330VDC Current Rating (Amps): 3.3A per Contact Mounting Type: Surface Mount, Right Angle Number of Positions: 20 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.135" (3.43mm) Row Spacing - Mating: 0.050" (1.27mm) Number of Rows: 2 |
на замовлення 220 шт: термін постачання 21-31 дні (днів) |
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CLP-110-02-F-DH | Samtec |
Headers & Wire Housings Low Profile Dual-Wipe Socket, .050" Pitch |
на замовлення 162 шт: термін постачання 21-30 дні (днів) |
В кошику од. на суму грн. | ||||||
 |
CLP-110-02-F-DH | SAMTEC |
Description: SAMTEC - CLP-110-02-F-DH - Printbuchse, Board-to-Board, 1.27 mm, 2 Reihe(n), 20 Kontakt(e), Oberflächenmontage, abgewinkelt tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze Steckverbindermontage: Oberflächenmontage, abgewinkelt usEccn: EAR99 Anzahl der Kontakte: 20Kontakt(e) euEccn: NLR Steckverbindersysteme: Board-to-Board Produktpalette: CLP productTraceability: No Anzahl der Reihen: 2Reihe(n) Rastermaß: 1.27mm SVHC: No SVHC (14-Jun-2023) |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. |
| CLP-110-02-F-DH |
|
Виробник: Samtec Inc.
Description: CONN RCPT 20P 0.05 GOLD SMD R/A
Packaging: Tube
Connector Type: Receptacle
Voltage Rating: 240VAC, 330VDC
Current Rating (Amps): 3.3A per Contact
Mounting Type: Surface Mount, Right Angle
Number of Positions: 20
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.135" (3.43mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
Description: CONN RCPT 20P 0.05 GOLD SMD R/A
Packaging: Tube
Connector Type: Receptacle
Voltage Rating: 240VAC, 330VDC
Current Rating (Amps): 3.3A per Contact
Mounting Type: Surface Mount, Right Angle
Number of Positions: 20
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.135" (3.43mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
на замовлення 220 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 475.30 грн |
| 10+ | 413.87 грн |
| 100+ | 362.35 грн |
| CLP-110-02-F-DH |
|
Виробник: Samtec
Headers & Wire Housings Low Profile Dual-Wipe Socket, .050" Pitch
Headers & Wire Housings Low Profile Dual-Wipe Socket, .050" Pitch
на замовлення 162 шт:
термін постачання 21-30 дні (днів)
| CLP-110-02-F-DH |
|
Виробник: SAMTEC
Description: SAMTEC - CLP-110-02-F-DH - Printbuchse, Board-to-Board, 1.27 mm, 2 Reihe(n), 20 Kontakt(e), Oberflächenmontage, abgewinkelt
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
Steckverbindermontage: Oberflächenmontage, abgewinkelt
usEccn: EAR99
Anzahl der Kontakte: 20Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Produktpalette: CLP
productTraceability: No
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 1.27mm
SVHC: No SVHC (14-Jun-2023)
Description: SAMTEC - CLP-110-02-F-DH - Printbuchse, Board-to-Board, 1.27 mm, 2 Reihe(n), 20 Kontakt(e), Oberflächenmontage, abgewinkelt
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
Steckverbindermontage: Oberflächenmontage, abgewinkelt
usEccn: EAR99
Anzahl der Kontakte: 20Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Produktpalette: CLP
productTraceability: No
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 1.27mm
SVHC: No SVHC (14-Jun-2023)
на замовлення 4 шт:
термін постачання 21-31 дні (днів)