CLP-113-02-F-D SAMTEC
Виробник: SAMTEC
Description: SAMTEC - CLP-113-02-F-D - Printbuchse, Board-to-Board, 1.27 mm, 2 Reihe(n), 26 Kontakt(e), Oberflächenmontage, CLP
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
Ausführung: Buchse
Steckverbindermontage: Oberflächenmontage
usEccn: EAR99
Anzahl der Kontakte: 26Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Produktpalette: CLP
productTraceability: No
Kontaktanschluss: Oberflächenmontage
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 1.27mm
SVHC: No SVHC (25-Jun-2025)
| Кількість | Ціна |
|---|---|
| 3+ | 315.60 грн |
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Технічний опис CLP-113-02-F-D SAMTEC
Description: CONN RCPT 26POS 0.05 GOLD SMD, Packaging: Bulk, Connector Type: Receptacle, Voltage Rating: 240VAC, 330VDC, Current Rating (Amps): 3.3A per Contact, Mounting Type: Surface Mount, Number of Positions: 26, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Insulation Height: 0.084" (2.14mm), Row Spacing - Mating: 0.050" (1.27mm), Number of Rows: 2.
Інші пропозиції CLP-113-02-F-D
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
 |
CLP-113-02-F-D | Виробник : Samtec |
Headers & Wire Housings Low Profile Dual-Wipe Socket, 0.050 Pitch |
на замовлення 68 шт: термін постачання 21-30 дні (днів) |
|
 |
CLP-113-02-F-D | Виробник : Samtec Inc. |
Description: CONN RCPT 26POS 0.05 GOLD SMD Packaging: Bulk Connector Type: Receptacle Voltage Rating: 240VAC, 330VDC Current Rating (Amps): 3.3A per Contact Mounting Type: Surface Mount Number of Positions: 26 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.050" (1.27mm) Number of Rows: 2 |
товару немає в наявності |