CLP-122-02-F-D SAMTEC
Виробник: SAMTECDescription: SAMTEC - CLP-122-02-F-D - Printbuchse, Board-to-Board, 1.27 mm, 2 Reihe(n), 44 Kontakt(e), Oberflächenmontage, CLP
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
Steckverbindermontage: Oberflächenmontage
usEccn: EAR99
Anzahl der Kontakte: 44Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Produktpalette: CLP
productTraceability: No
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 1.27mm
SVHC: No SVHC (14-Jun-2023)
на замовлення 18 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 468.4 грн |
| 10+ | 384.73 грн |
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Технічний опис CLP-122-02-F-D SAMTEC
Description: CONN RCPT 44POS 0.05 GOLD SMD, Packaging: Bulk, Connector Type: Receptacle, Voltage Rating: 240VAC, 330VDC, Current Rating (Amps): 3.3A per Contact, Mounting Type: Surface Mount, Number of Positions: 44, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.90µin (0.099µm), Contact Finish - Post: Tin, Insulation Height: 0.090" (2.29mm), Row Spacing - Mating: 0.050" (1.27mm), Number of Rows: 2.
Інші пропозиції CLP-122-02-F-D
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
 |
CLP-122-02-F-D | Виробник : Samtec Inc. |
Description: CONN RCPT 44POS 0.05 GOLD SMD Packaging: Bulk Connector Type: Receptacle Voltage Rating: 240VAC, 330VDC Current Rating (Amps): 3.3A per Contact Mounting Type: Surface Mount Number of Positions: 44 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.90µin (0.099µm) Contact Finish - Post: Tin Insulation Height: 0.090" (2.29mm) Row Spacing - Mating: 0.050" (1.27mm) Number of Rows: 2 |
товар відсутній |
|
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CLP-122-02-F-D | Виробник : Samtec |
Headers & Wire Housings Low Profile Dual-Wipe Socket, .050" Pitch |
товар відсутній |