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CLP-122-02-L-D-P

CLP-122-02-L-D-P Samtec

clp_sm.pdf Виробник: Samtec
Headers & Wire Housings Low Profile Dual-Wipe Socket
на замовлення 35 шт:
термін постачання 21-30 дні (днів)
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10+445.50 грн
60+321.40 грн
100+295.78 грн
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Технічний опис CLP-122-02-L-D-P Samtec

Description: CONN RCPT 44POS 0.05 GOLD SMD, Features: Pick and Place, Packaging: Tube, Connector Type: Receptacle, Voltage Rating: 240VAC, 330VDC, Current Rating (Amps): 3.3A per Contact, Mounting Type: Surface Mount, Number of Positions: 44, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Insulation Height: 0.084" (2.14mm), Row Spacing - Mating: 0.050" (1.27mm), Number of Rows: 2.

Інші пропозиції CLP-122-02-L-D-P

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CLP-122-02-L-D-P CLP-122-02-L-D-P Виробник : Samtec Inc. clp_sm.pdf Description: CONN RCPT 44POS 0.05 GOLD SMD
Features: Pick and Place
Packaging: Tube
Connector Type: Receptacle
Voltage Rating: 240VAC, 330VDC
Current Rating (Amps): 3.3A per Contact
Mounting Type: Surface Mount
Number of Positions: 44
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
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