CLP-123-02-L-DH Samtec Inc.
Виробник: Samtec Inc.
Description: CONN RCPT 46P 0.05 GOLD SMD R/A
Style: Board to Board
Number of Positions: 46
Mounting Type: Surface Mount, Right Angle
Current Rating (Amps): 3.3A per Contact
Voltage Rating: 240VAC, 330VDC
Connector Type: Receptacle
Packaging: Tube
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Insulation Height: 0.135" (3.43mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Відгуки про товар
Написати відгук
Технічний опис CLP-123-02-L-DH Samtec Inc.
Description: CONN RCPT 46P 0.05 GOLD SMD R/A, Style: Board to Board, Number of Positions: 46, Mounting Type: Surface Mount, Right Angle, Current Rating (Amps): 3.3A per Contact, Voltage Rating: 240VAC, 330VDC, Connector Type: Receptacle, Packaging: Tube, Number of Rows: 2, Row Spacing - Mating: 0.050" (1.27mm), Insulation Height: 0.135" (3.43mm), Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm), Insulation Color: Black, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Female Socket, Operating Temperature: -55°C ~ 125°C.
Інші пропозиції CLP-123-02-L-DH
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
 |
CLP-123-02-L-DH | Samtec |
 Headers & Wire Housings Low Profile Dual-Wipe Socket, .050" Pitch |
товару немає в наявності |
В кошику од. на суму грн. |
| CLP-123-02-L-DH |
|
Виробник: Samtec
Headers & Wire Housings Low Profile Dual-Wipe Socket, .050" Pitch
Headers & Wire Housings Low Profile Dual-Wipe Socket, .050" Pitch
товару немає в наявності
В кошику
од. на суму грн.