CLP-124-02-F-D Samtec Inc.
Виробник: Samtec Inc.Description: CONN RCPT 48POS 0.05 GOLD SMD
Packaging: Bulk
Connector Type: Receptacle
Voltage Rating: 240VAC, 330VDC
Current Rating (Amps): 3.3A per Contact
Mounting Type: Surface Mount
Number of Positions: 48
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.90µin (0.099µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.090" (2.29mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
на замовлення 1313 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 699.40 грн |
| 10+ | 644.12 грн |
| 25+ | 585.56 грн |
| 50+ | 522.06 грн |
| 100+ | 508.31 грн |
| 250+ | 453.36 грн |
| 500+ | 418.90 грн |
Відгуки про товар
Написати відгук
Технічний опис CLP-124-02-F-D Samtec Inc.
Description: CONN RCPT 48POS 0.05 GOLD SMD, Packaging: Bulk, Connector Type: Receptacle, Voltage Rating: 240VAC, 330VDC, Current Rating (Amps): 3.3A per Contact, Mounting Type: Surface Mount, Number of Positions: 48, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.90µin (0.099µm), Contact Finish - Post: Tin, Part Status: Active, Insulation Height: 0.090" (2.29mm), Row Spacing - Mating: 0.050" (1.27mm), Number of Rows: 2.
Інші пропозиції CLP-124-02-F-D
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
 |
CLP-124-02-F-D | Виробник : Samtec |
Headers & Wire Housings Low Profile Dual-Wipe Socket, 0.050 Pitch |
товару немає в наявності |