CLP-126-02-L-DH Samtec Inc.
Виробник: Samtec Inc.
Description: CONN RCPT 52P 0.05 GOLD SMD R/A
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Insulation Height: 0.135" (3.43mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 52
Mounting Type: Surface Mount, Right Angle
Current Rating (Amps): 3.3A per Contact
Voltage Rating: 240VAC, 330VDC
Connector Type: Receptacle
Packaging: Tube
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Технічний опис CLP-126-02-L-DH Samtec Inc.
Description: CONN RCPT 52P 0.05 GOLD SMD R/A, Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm), Insulation Color: Black, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Rows: 2, Row Spacing - Mating: 0.050" (1.27mm), Insulation Height: 0.135" (3.43mm), Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Female Socket, Operating Temperature: -55°C ~ 125°C, Style: Board to Board, Number of Positions: 52, Mounting Type: Surface Mount, Right Angle, Current Rating (Amps): 3.3A per Contact, Voltage Rating: 240VAC, 330VDC, Connector Type: Receptacle, Packaging: Tube.
Інші пропозиції CLP-126-02-L-DH
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
 |
CLP-126-02-L-DH | Samtec |
 Headers & Wire Housings Low Profile Dual-Wipe Socket |
товару немає в наявності |
В кошику од. на суму грн. |
| CLP-126-02-L-DH |
|
Виробник: Samtec
Headers & Wire Housings Low Profile Dual-Wipe Socket
Headers & Wire Housings Low Profile Dual-Wipe Socket
товару немає в наявності
В кошику
од. на суму грн.