CYPD3197-24LDXS Infineon Technologies

Description: CCG3PA, Packaging: Tray, Package / Case: 24-UFQFN Exposed Pad, Mounting Type: Surface Mount, Wettable Flank, Interface: I2C, SPI, UART, USB, RAM Size: 8K x 8, Operating Temperature: -40°C ~ 85°C, Voltage - Supply: 3V ~ 24.5V, Program Memory Type: FLASH (64kB), Applications: USB Type C, Core Processor: ARM® Cortex®-M0, Supplier Device Package: 24-QFN (4x4), Part Status: Active, Number of I/O: 12, DigiKey Programmable: Not Verified.